Back to results
US 12,745,622 B2Granted
Die-to-die power delivery
AssigneeAltera Corporation
InventorsAnkireddy Nalamalpu, Mahesh K. Kumashikar, Atul Maheshwari, Lai Guan Tang
Life of this patent
Estimating the term…
Abstract
A die includes one or more power delivery layers to deliver power within the die. Additionally, the die also includes one or more transistor layers to at least partially implement a programmable fabric for the die. Furthermore, the die further includes one or more signal routing layers to transmit signals for use by the programmable fabric. Moreover, the one or more transistor layers physically separate the one or more power delivery layers from the one or more signal routing layers.
Claims20
A system, comprising:
- a first die;
- and
- a second die coupled to the first die, wherein the second die comprises:
- one or more power delivery layers to deliver power within the second die, to deliver die-to-die signals to and from the first die, and to deliver clock signals;
- one or more transistor layers to at least partially implement a programmable fabric for the second die;
- one or more signal routing layers to transmit signals for use by the programmable fabric, wherein the one or more transistor layers physically separate the one or more power delivery layers from the one or more signal routing layers;
- and
- bumps to enable power delivery to the second die and to transmit IO signals to the one or more transistor layers through the one or more power delivery layers.
5 more elements
A package, comprising:
- an interconnect;
- a first die;
- and
- a second die coupled to the first die via the interconnect, wherein the second die comprises:
- a transistor layer comprising a plurality of transistors to at least partially implement a programmable fabric for the second die;
- and
- a signal routing metal layer located on a first side of the second die and to transmit signals for use by the programmable fabric;
- a power delivery metal layer located on a second side of the second die and to deliver power within the second die, wherein the transistor layer physically separates the power delivery metal layer from the signal routing metal layer, and the power delivery metal layer is to transport data between the first die and the second die without encroaching on the signal routing metal layer;
- and
- microbumps to enable power delivery to the second die and to transmit IO signals to the transistor layer through the power delivery metal layer.
7 more elements
A system, comprising:
- a first die;
- an interconnect coupled to the first die;
- and
- a second die, comprising:
- a power delivery metal layer to deliver power, die-to-die signals, and clock signals within the second die;
- a transistor layer comprising a plurality of transistors to at least partially implement a programmable fabric for the second die;
- a signal routing metal layer to transmit signals for use by the programmable fabric, wherein the transistor layer physically separates the power delivery metal layer from the signal routing metal layer;
- and
- bumps to enable power delivery to the second die and to transmit IO signals to the transistor layer through one or more power delivery layer.
6 more elements
Dependencies are inferred from the claim text.