H10W 20/493
Fuses, i.e. interconnections changeable from conductive to non-conductive
Official title: {Fuses, i.e. interconnections changeable from conductive to non-conductive}
H10W20/493 (Fuses, i.e. interconnections changeable from conductive to non-conductive) appears on 2,329 US grants and 2,231 published applications in this corpus.
Search patents in H10W- Granted patents
- 2,329
- Published applications
- 2,231
- Assignees
- 421
- Inventors
- 3,406
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 5 | 0 |
| 1978 | 3 | 0 |
| 1979 | 3 | 0 |
| 1980 | 6 | 0 |
| 1981 | 3 | 0 |
| 1982 | 1 | 0 |
| 1983 | 7 | 0 |
| 1984 | 11 | 0 |
| 1985 | 10 | 0 |
| 1986 | 4 | 0 |
| 1987 | 9 | 0 |
| 1988 | 10 | 0 |
| 1989 | 14 | 0 |
| 1990 | 8 | 0 |
| 1991 | 18 | 0 |
| 1992 | 7 | 0 |
| 1993 | 15 | 0 |
| 1994 | 17 | 0 |
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| 1996 | 17 | 0 |
| 1997 | 26 | 0 |
| 1998 | 38 | 0 |
| 1999 | 48 | 0 |
| 2000 | 51 | 0 |
| 2001 | 93 | 28 |
| 2002 | 97 | 86 |
| 2003 | 97 | 101 |
| 2004 | 86 | 92 |
| 2005 | 63 | 108 |
| 2006 | 53 | 110 |
| 2007 | 53 | 143 |
| 2008 | 63 | 135 |
| 2009 | 77 | 121 |
| 2010 | 117 | 104 |
| 2011 | 92 | 99 |
| 2012 | 95 | 97 |
| 2013 | 109 | 73 |
| 2014 | 83 | 94 |
| 2015 | 97 | 91 |
| 2016 | 81 | 72 |
| 2017 | 82 | 90 |
| 2018 | 84 | 80 |
| 2019 | 77 | 68 |
| 2020 | 73 | 74 |
| 2021 | 59 | 55 |
| 2022 | 50 | 71 |
| 2023 | 62 | 84 |
| 2024 | 57 | 61 |
| 2025 | 54 | 69 |
| 2026 | 26 | 25 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Semiconductor device structure including fuse structure embedded in substrate6 Oct 2026US 12,757,389 B2Nanya Technology Corporation
- Semiconductor device having fuse component22 Sep 2026US 12,745,626 B2Nanya Technology Corporation
- Bimetallic fuse element between metal levels15 Sep 2026US 12,740,405 B2International Business Machines Corporation
- Semiconductor device and method of manufacture8 Sep 2026US 12,733,557 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Power component and system with the power component25 Aug 2026US 12,716,963 B2ABB Schweiz AG
- Electrostatic discharge (esd) circuits using front end (fe) diodes and metal-in-metal (mim) via fuses in interconnect layers1 Oct 2026US 2026/0305316 A1Intel Corporation
- Hard-coding an ic-specific code in an integrated circuit, device24 Sep 2026US 2026/0293663 A1Sandgrain B.V.
- Mim memory cell with backside interconnect structures17 Sep 2026US 2026/0282346 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Protecting device27 Aug 2026US 2026/0253829 A1Dexerials Corporation
- Methods and apparatus to improve performance of power path protection devices20 Aug 2026US 2026/0246260 A1Texas Instruments Incorporated
Most cited
By later US patents
- BEOL vertical fuse formed over air gap426US 9,666,528 B1International Business Machines Corporation · 2017
- Energy-efficient, laser-based method and system for processing target material290US 6,281,471 B1GSI Lumonics Corporation · 2001
- Methods for fabricating fuse programmable three dimensional integrated circuits279US 7,312,109 B2Viciciv · 2007
- Method of customizing integrated circuits by selective secondary deposition of layer interconnect material255US 5,885,749 AClear Logic, Inc. · 1999
- Semiconductor device254US 7,115,966 B2Renesas Technology Corp. · 2006