Semiconductor device and method of manufacture
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsHaohua Zhou, Mei Hsu Wong, Tze-Chiang Huang
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Abstract
A plurality of semiconductor devices are arranged in a stack. Individual semiconductor devices within the stack are selected by an identity signal sent into the stack. The signal is compared within each stack to a unique stack identifier stored within each of the semiconductor devices and, when the signal is the same as the unique stack identifier, the semiconductor device is selected while, when the signal is not the same as the unique stack identifier, the semiconductor device remains within the default bypass mode.
Claims20
A method of manufacturing a semiconductor device, the method comprising:
- receiving a first semiconductor die, the first semiconductor die comprising:
- a first input region;
- a first output region;
- a first inout region;
- a first identifier region;
- and
- a first external connection electrically connected to a first comparator, the first comparator also being electrically connected to the first identifier region, an output of the first comparator being connected to both the first output region and the first inout region;
- and
- bonding a second semiconductor die to the first semiconductor die, the second semiconductor die comprising:
- a second input region;
- a second output region;
- a second inout region;
- a second identifier region, the second identifier region having a different structure than the first identifier region;
- and
- a second comparator electrically connected to the first external connection by a through via, wherein an output of the second comparator is connected to both the second output region and the second inout region.
A method of manufacturing a semiconductor device, the method comprising:
- bonding a first semiconductor die to a second semiconductor die to form a first die stack, wherein after the bonding each of the first semiconductor die and the second semiconductor die comprises:
- an input region;
- an output region;
- an inout region;
- an identifier region;
- external connections electrically connected to respective comparators, the comparators being electrically connected to respective identifier regions, wherein after the bonding the die stack to the substrate different ones of the identifier regions have different structures, and wherein the comparator within the second semiconductor die is connected to a through via in the first semiconductor die;
- and
- bonding the die stack to a substrate.
A method of manufacturing a semiconductor device, the method comprising:
- bonding a first semiconductor die to a second semiconductor die to form a first die stack;
- bonding the die stack to a substrate;
- programming the first semiconductor die by sending programming signals through fuses;
- and
- programming the second semiconductor die after the programming the first semiconductor die and after the first semiconductor die is bonded to the second semiconductor die.
Dependencies are inferred from the claim text.