Methods for fabricating fuse programmable three dimensional integrated circuits
AssigneeViciciv
InventorRaminda Udaya Madurawe
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Abstract
A method of fabricating a field programmable integrated circuit comprised of: constructing a semiconductor device comprising a fuse circuit to customize the logic content of a programmable logic circuit; and attaching said semiconductor device in a detachable lid package, wherein the fuses are customized in the field by detaching the lid and blowing one or more fuse elements. The said method further comprised of: providing a custom hard-wire pattern in lieu of the fuse circuit, wherein the programmable logic circuit timing is identical between the fuse circuit and hard-wire options.
Claims20
A method of fabricating a field programmable integrated circuit comprised of:
- constructing a semiconductor device comprising a fuse circuit to customize the logic content of a programmable logic circuit;
- and
- attaching said semiconductor device in a detachable lid package, wherein the fuses are customized in the field by detaching the lid and blowing one or more fuse elements.
A method of forming a programmable semiconductor device comprised of:
- fabricating digital circuits comprising a programmable logic circuit on a substrate;
- fabricating an interconnect and routing structure substantially above the digital circuits;
- and
- fabricating a programmable fuse circuit above the routing structure to program said programmable logic circuit, wherein the fuse circuit is programmed to store binary data values.
A method of fabricating a programmable integrated circuit comprised of:
- fabricating a packaged semiconductor device comprising only a laser fuse circuit as the top most metal layer to customize the logic content of a programmable logic circuit.
Dependencies are inferred from the claim text.