BEOL vertical fuse formed over air gap
AssigneeInternational Business Machines Corporation
InventorsMarc A. Bergendahl, James J. Demarest, Christopher J. Penny, Christopher J. Waskiewicz
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Abstract
A method of forming an electrical device that includes forming a first level including an array of metal lines, wherein an air gap is positioned between the adjacent metal lines. A second level is formed including at least one dielectric layer atop the first level. A plurality of trench structures is formed in the at least on dielectric layer. At least one of the plurality of trench structures opens the air gap. A conductive material is formed within the trenches. The conductive material deposited in the open air gap provides a vertical fuse.
Claims14
A method of forming an electrical device comprising:
- forming an array of metal lines;
- depositing a dielectric cap atop and within the space separating adjacent metal lines within the array of metal lines, wherein a thickness of the dielectric cap pinches off within the space separating said adjacent metal lines to substantially enclose a plurality of air gaps;
- depositing at least one interlevel dielectric layer overlying a level including said air gaps and said array of metal lines, wherein the interlevel dielectric layer entirely encapsulates the plurality of air gaps;
- forming a plurality of trenches in the interlevel dielectric layer, wherein at least one trench opens at least one of the plurality of air gaps;
- and
- depositing an electrically conductive material in the trenches to form a vertical fuse in an opened air gap, the vertical fuse being present in said space between adjacent metal lines.
A method of forming an electrical device comprising:
- forming a first level including an array of metal lines, wherein at least one set of adjacent metal lines in said array of metal lines includes an air gap positioned therebetween;
- forming a second level including at least one dielectric layer atop the first level;
- forming a plurality of trench structures in the at least one dielectric layer, wherein at least one of the plurality of trench structures opens the air gap, and at least one of the plurality of trench structures is to a depth that does not communicate with the air gap;
- and
- forming a conductive material within the trenches, wherein the conductive material deposited in the open air gap provides a vertical fuse, and the portion of the conductive material formed in the plurality of trench structures that do not communicate with the air gap provide interconnect structures.
Dependencies are inferred from the claim text.