Microelectronic mechanical fuse and anti-fuse apparatus and method

An apparatus, comprising:

• a first conductive pad and a second conductive pad set into a substrate, the first conductive pad electrically coupled to an integrated circuit (IC) input, the first and second conductive pads not otherwise electrically coupled to each other;
• at least one layer of a dielectric material deposited above the first and second conductive pads;
• at least one layer of an energetic material deposited above the dielectric layer, the energetic material coupled to an ignition circuit;
• and
• at least one layer of a conductive alloy deposited above the energetic layer;
• wherein the ignition circuit is configured to trigger a thermal reaction in the energetic material, the thermal reaction generating a thermal energy causing:
• 1) At least one of melting and removing the at least one dielectric layer and the at least one energetic layer;
• 2) Melting the at least one conductive alloy layer;
• and
• 3) Electrically bridging the first and second conductive pads via the conductive alloy layer;
• and
• wherein the thermal energy generated by the thermal reaction is insufficient to damage the substrate.

A method for forming an anti-fuse on an apparatus, the method comprising:

• depositing a layer of a dielectric material over a portion of a substrate, the portion including a first conductive pad and a second conductive pad set thereinto, the first conductive pad electrically coupled to an integrated circuit (IC) input, the first and second conductive pads not otherwise electrically coupled to each other;
• depositing a layer of a conductive alloy over the dielectric layer;
• depositing, via an additive manufacturing method, at least one layer of an energetic material over a portion of the conductive alloy layer;
• connecting the at least one layer of the energetic material to an ignition circuit, the ignition circuit configured to trigger a thermal reaction in the at least one energetic layer, the thermal reaction generating a thermal energy causing:
• 1) At least one of melting and removing the at least one dielectric layer;
• 2) Melting the at least one conductive alloy layer;
• and
• 3) Electrically bridging the first and second conductive pads via the conductive alloy layer:
• and
• wherein the thermal energy generated by the thermal reaction is insufficient to damage the substrate.