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US 2026/0309942 A1Published application
Heterogeneous packaging integration of photonic and electronic elements
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsStefan RUSU, Weiwei SONG, Mohammed Rabiul ISLAM
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Abstract
Heterogeneous packaging integration of photonic and electronic elements is described herein. In one embodiment, a disclosed package includes: a package substrate; a first layer comprising an electronic die on the package substrate; and a second layer comprising a photonic die. The second layer is bonded onto the first layer such that the photonic die is bonded onto the electronic die.
Claims20
An integrated circuit package, comprising:
- a package substrate;
- a first layer disposed over the package substrate and comprising an electronic die;
- a second layer comprising a photonic die bonded face-to-face with the electronic die and a top die laterally separated from the photonic die;
- and
- a heat spreader formed over and in thermal contact with upper surfaces of the second layer, the heat spreader including a thermal break filled with a thermal isolation material, wherein the thermal break is located between the top die and the photonic die to restrict lateral heat transfer therebetween.
2 more elements
A method of fabricating a semiconductor device, comprising:
- defining a geometric pattern onto a first layer using photolithography;
- etching the first layer to provide etched regions in the first layer based on the geometric pattern;
- epitaxially growing one or more semiconductor materials in the etched regions to form electronic dies, a bottom die, and vias;
- and
- hybrid bonding a photonic die of a second layer in a face-to-face configuration onto a corresponding electronic die of the first layer via hybrid bonds such that the photonic die is bonded onto and in contact with the corresponding electronic die, wherein the corresponding electronic die includes a driver circuit for controlling elements in the photonic die.
2 more elements
A semiconductor device, comprising:
- a package substrate;
- a first layer comprising an electronic die on the package substrate;
- a second layer comprising a photonic die bonded onto the first layer,
- wherein the photonic die includes a silicon waveguide;
- a mold on the package substrate adjacent to the electronic die in the first layer, wherein the mold serves as a support;
- and
- a polymer waveguide on the mold and aligned to the photonic die configured to guide light in or out of the silicon waveguide in the photonic die.
4 more elements
Dependencies are inferred from the claim text.