H10W 76/00
Containers
Official title: Containers; Fillings or auxiliary members therefor; Seals
H10W76/00 (Containers) appears on 9,415 US grants and 10,012 published applications in this corpus.
Search patents in H10W- Granted patents
- 9,415
- Published applications
- 10,012
- Assignees
- 1,839
- Inventors
- 16,042
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 33 | 0 |
| 1977 | 23 | 0 |
| 1978 | 25 | 0 |
| 1979 | 26 | 0 |
| 1980 | 25 | 0 |
| 1981 | 36 | 0 |
| 1982 | 31 | 0 |
| 1983 | 31 | 0 |
| 1984 | 25 | 0 |
| 1985 | 42 | 0 |
| 1986 | 35 | 0 |
| 1987 | 53 | 0 |
| 1988 | 44 | 0 |
| 1989 | 60 | 0 |
| 1990 | 48 | 0 |
| 1991 | 77 | 0 |
| 1992 | 77 | 0 |
| 1993 | 60 | 0 |
| 1994 | 82 | 0 |
| 1995 | 91 | 0 |
| 1996 | 73 | 0 |
| 1997 | 83 | 0 |
| 1998 | 132 | 0 |
| 1999 | 146 | 0 |
| 2000 | 136 | 0 |
| 2001 | 139 | 68 |
| 2002 | 179 | 212 |
| 2003 | 169 | 183 |
| 2004 | 190 | 247 |
| 2005 | 184 | 267 |
| 2006 | 163 | 257 |
| 2007 | 163 | 258 |
| 2008 | 136 | 238 |
| 2009 | 177 | 229 |
| 2010 | 201 | 247 |
| 2011 | 211 | 252 |
| 2012 | 208 | 266 |
| 2013 | 249 | 324 |
| 2014 | 281 | 365 |
| 2015 | 380 | 453 |
| 2016 | 416 | 486 |
| 2017 | 462 | 520 |
| 2018 | 484 | 515 |
| 2019 | 503 | 554 |
| 2020 | 501 | 587 |
| 2021 | 432 | 599 |
| 2022 | 453 | 611 |
| 2023 | 443 | 682 |
| 2024 | 454 | 657 |
| 2025 | 465 | 586 |
| 2026 | 278 | 349 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Semiconductor package and method of manufacturing the same6 Oct 2026US 12,757,796 B2Samsung Electronics Co., Ltd.
- Package structure with protective lid6 Oct 2026US 12,757,797 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Method for manufacturing and module of a semiconductor power module with heat dissipation function29 Sep 2026US 12,751,285 B2Hitachi Energy Ltd
- Anchor-containing underfill structures for a chip package and methods of forming the same29 Sep 2026US 12,751,304 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor module29 Sep 2026US 12,751,318 B2Fuji Electric Co., Ltd.
- Semiconductor device8 Oct 2026US 2026/0314398 A1Taiwan Semiconductor Manufacturing Company.Ltd
- System-in-package (sip) configured to receive multiple memory dies8 Oct 2026US 2026/0314443 A1QUALCOMM Incorporated
- Semiconductor package including connecting pads8 Oct 2026US 2026/0314451 A1Samsung Electronics Co., Ltd.
- Method of filling gaps between dies using silicon dioxide8 Oct 2026US 2026/0314481 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Integrated circuit packages, devices using the same, and methods of forming the same8 Oct 2026US 2026/0314483 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Methods and devices for fabricating and assembling printable semiconductor elements883US 7,622,367 B1The Board of Trustees of the University of Illinois · 2009
- Stretchable semiconductor elements and stretchable electrical circuits765US 7,557,367 B2The Board of Trustees of the University of Illinois · 2009
- Hermetically sealed electrical feedthrough for use with implantable electronic devices698US 5,750,926 AAlfred E. Mann Foundation for Scientific Research · 1998
- Semiconductor device in a resin package housed in a frame having high thermal conductivity660US 5,625,222 AFujitsu Limited · 1997
- Hermetically sealed printed circuit boards511US 10,588,231 B2Covidien LP · 2020