H10W 76/10
Containers or parts thereof
H10W76/10 (Containers or parts thereof) appears on 5,705 US grants and 6,079 published applications in this corpus.
Search patents in H10W- Granted patents
- 5,705
- Published applications
- 6,079
- Assignees
- 1,320
- Inventors
- 10,175
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 31 | 0 |
| 1977 | 19 | 0 |
| 1978 | 20 | 0 |
| 1979 | 24 | 0 |
| 1980 | 21 | 0 |
| 1981 | 32 | 0 |
| 1982 | 29 | 0 |
| 1983 | 27 | 0 |
| 1984 | 18 | 0 |
| 1985 | 31 | 0 |
| 1986 | 28 | 0 |
| 1987 | 41 | 0 |
| 1988 | 34 | 0 |
| 1989 | 46 | 0 |
| 1990 | 36 | 0 |
| 1991 | 51 | 0 |
| 1992 | 50 | 0 |
| 1993 | 39 | 0 |
| 1994 | 57 | 0 |
| 1995 | 50 | 0 |
| 1996 | 40 | 0 |
| 1997 | 44 | 0 |
| 1998 | 66 | 0 |
| 1999 | 52 | 0 |
| 2000 | 52 | 0 |
| 2001 | 60 | 27 |
| 2002 | 77 | 83 |
| 2003 | 79 | 78 |
| 2004 | 85 | 114 |
| 2005 | 78 | 117 |
| 2006 | 84 | 125 |
| 2007 | 81 | 127 |
| 2008 | 60 | 122 |
| 2009 | 85 | 109 |
| 2010 | 107 | 118 |
| 2011 | 84 | 134 |
| 2012 | 110 | 145 |
| 2013 | 135 | 186 |
| 2014 | 149 | 218 |
| 2015 | 218 | 297 |
| 2016 | 286 | 324 |
| 2017 | 298 | 357 |
| 2018 | 338 | 347 |
| 2019 | 336 | 362 |
| 2020 | 318 | 382 |
| 2021 | 299 | 391 |
| 2022 | 287 | 401 |
| 2023 | 275 | 470 |
| 2024 | 318 | 446 |
| 2025 | 327 | 378 |
| 2026 | 193 | 221 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Method for manufacturing and module of a semiconductor power module with heat dissipation function29 Sep 2026US 12,751,285 B2Hitachi Energy Ltd
- Semiconductor module29 Sep 2026US 12,751,318 B2Fuji Electric Co., Ltd.
- Electronic devices and methods of manufacturing electronic devices29 Sep 2026US 12,751,321 B2Amkor Technology Singapore Holding Pte.Ltd.
- Semiconductor device, power conversion device and moving body22 Sep 2026US 12,745,640 B2Mitsubishi Electric Corporation
- Package structure including a package lid having a plurality of fins and methods of forming the same15 Sep 2026US 12,740,411 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor device8 Oct 2026US 2026/0314398 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor package including connecting pads8 Oct 2026US 2026/0314451 A1Samsung Electronics Co., Ltd.
- Die attachment film, dicing die bonding film, and semiconductor device manufacturing method1 Oct 2026US 2026/0305443 A1Resonac Corporation
- Component package and method for the production thereof1 Oct 2026US 2026/0305460 A1ams-OSRAM International GmbH
- Semiconductor module arrangement1 Oct 2026US 2026/0305489 A1Infineon Technologies AG
Most cited
By later US patents
- Methods and devices for fabricating and assembling printable semiconductor elements883US 7,622,367 B1The Board of Trustees of the University of Illinois · 2009
- Stretchable semiconductor elements and stretchable electrical circuits765US 7,557,367 B2The Board of Trustees of the University of Illinois · 2009
- Hermetically sealed electrical feedthrough for use with implantable electronic devices698US 5,750,926 AAlfred E. Mann Foundation for Scientific Research · 1998
- System and method for gas-phase sulfur passivation of a semiconductor surface483US 9,558,931 B2ASM IP Holding B. V. · 2017
- High-density electronic package, and method for making same437US 6,376,769 B1Amerasia International Technology, Inc. · 2002