Semiconductor module arrangement

A semiconductor module arrangement, comprising:

• a housing comprising a first lateral side, a second lateral side opposite the first lateral side, a third lateral side perpendicular to the first lateral side and the second lateral side, and a fourth lateral side opposite the third lateral side;
• a first substrate and a second substrate arranged in the housing such that the first substrate is arranged between the second substrate and the third lateral side, each of the first and second substrate comprising a dielectric insulation layer and a first metallization layer arranged on a surface of the dielectric insulation layer, wherein the first metallization layer comprises a first section and a second section;
• and
• a first semiconductor element arranged on the first substrate and a second semiconductor element arranged on the second substrate, wherein each of the first and second semiconductor element comprises a first contact pad and a second contact pad,
• wherein the second contact pad of the first semiconductor element is electrically coupled to the first section of the first substrate,
• wherein the second contact pad of the second semiconductor element is electrically coupled to the first section of the second substrate,
• wherein the first contact pad of the first semiconductor element is electrically coupled to the second section of the first substrate,
• wherein the first contact pad of the second semiconductor element is electrically coupled to the second section of the second substrate,
• wherein the semiconductor module arrangement further comprises:
• a first supply terminal electrically coupled to the first section of the first substrate;
• a second supply terminal electrically coupled to the second section of the second substrate;
• and
• one or more output terminals electrically coupled to the second section of the first substrate and the first section of the second substrate,
• wherein the first supply terminal, the second supply terminal and the one or more output terminals are arranged in a third section of the housing arranged between the third lateral side and the fourth lateral side,
• wherein a distance between the third section of the housing and the third lateral side essentially equals a distance between the third section of the housing and the fourth lateral side.