Semiconductor device, power conversion device and moving body

A semiconductor device, comprising:

• an exterior including an inner space and an inner surface surrounding the inner space;
• a semiconductor chip housed in the inner space and mounted on the inner surface;
• a first sealing material filling a first portion of the inner space, disposed on the inner surface such that the first sealing material overlaps the semiconductor chip, and made up of silicone gel;
• a waterproof water-repellent layer housed in the inner space, disposed on the inner surface and over the first sealing material such that the waterproof water-repellent layer overlaps the semiconductor chip and the first sealing material, and made up of fluorine-series resin or silicone-series resin;
• and
• a second sealing material filling a second portion of the inner space, disposed on the inner surface and over the waterproof water-repellent layer such that the second sealing material overlaps the semiconductor chip, the first sealing material, and the waterproof water-repellent layer, and made up of silicone gel, the second sealing material directly contacting the waterproof water-repellent layer, wherein
• the second sealing material has higher hardness than the first sealing material.