Electronic devices and methods of manufacturing electronic devices

An electronic device, comprising:

• a substrate comprising a substrate top side, a substrate bottom side opposite to the substrate top side and comprising a substrate dielectric structure and a substrate conductive structure;
• a first electronic component coupled to the substrate conductive structure at the substrate top side and comprising a first electronic component top side distal to the substrate top side;
• a second electronic component coupled to the substrate conductive structure at the substrate top side, laterally spaced apart from the first electronic component, and comprising a second electronic component top side distal to the substrate top side;
• a component dam coupled to the first electronic component top side and defining a component dam cavity, wherein the component dam comprises a component dam top side;
• an enclosure coupled to the substrate and over the first electronic component and the second electronic component, the enclosure comprising:
• an enclosure ceiling;
• an enclosure wall extending from the enclosure ceiling and defining an enclosure periphery;
• and
• an enclosure dam within the enclosure periphery and coupled to the enclosure ceiling and the component dam and defining an enclosure dam cavity, wherein the enclosure dam comprises enclosure dam bottom side;
• a first interface material over the first electronic component top side and within the component dam cavity and the enclosure dam cavity;
• and
• a second interface material over the second electronic component top side;
• wherein:
• the first interface material comprises a first thermal conductivity;
• the second interface material comprises a second thermal conductivity different than the first thermal conductivity;
• the enclosure dam comprises a larger planar area than the component dam and the enclosure dam is vertically aligned with and vertically overlaps the component dam to form a nested enclosure;
• the enclosure dam laterally extends into a portion of the second interface material;
• and
• the enclosure dam bottom side is attached to the component dam top side such that the enclosure dam and the component dam form a continuous barrier configured to physically separate the first interface material from the second interface material and to restrict overflow of the first interface material toward the second interface material during curing.

A method of manufacturing an electronic device, comprising:

• providing a substrate comprising a substrate top side, a substrate bottom side opposite to the substrate top side and comprising a substrate dielectric structure and a substrate conductive structure;
• coupling a first electronic component to the substrate conductive structure at the substrate top side, the first electronic component comprising a first electronic component top side distal to the substrate top side and a component dam coupled to the first electronic component top side that defines a component dam cavity, wherein the component dam comprises a component dam top side;
• coupling a second electronic component to the substrate conductive structure at the substrate top side, laterally spaced apart from the first electronic component, and comprising a second electronic component top side distal to the substrate top side devoid of any dam structure;
• providing a first interface material over the first electronic component top side and within the component dam cavity;
• providing a second interface material over the second electronic component top side;
• providing an enclosure comprising:
• an enclosure ceiling;
• an enclosure wall extending from the enclosure ceiling and defining an enclosure periphery;
• and
• an enclosure dam within the enclosure periphery and coupled to the enclosure ceiling and the component dam and defining an enclosure dam cavity, wherein the enclosure dam comprises an enclosure dam bottom side;
• coupling the enclosure to the substrate over the first electronic component and the second electronic component;
• and
• curing the first interface material and the second interface material;
• wherein:
• the first interface material comprises a first thermal conductivity;
• the second interface material comprises a second thermal conductivity different than the first thermal conductivity;
• the enclosure dam comprises a larger planar area than the component dam and the enclosure dam is vertically aligned with and vertically overlaps the component dam to form a nested enclosure;
• the enclosure dam laterally extends into a portion of the second interface material;
• and
• the enclosure dam bottom side is attached to the component dam top side such that the enclosure dam and the component dam form a continuous barrier configured to physically separate the first interface material from the second interface material and to restrict overflow of the first interface material toward the second interface material during the curing.