Semiconductor module

A semiconductor module comprising:

• a base part having:
• a plurality of semiconductor elements,
• a cooling unit configured to cool the plurality of semiconductor elements,
• a rectangular shape with a pair of short sides, a pair of long sides, and four corners in a plan view, and
• a through-hole closer to a first short side of the pair of short sides than to both long sides of the pair of long sides;
• and
• a case part attached to the base part and having:
• a peripheral portion having a rectangular frame shape,
• a partition that partitions inside of the peripheral portion to define a space in which the plurality of semiconductor elements are disposed,
• a side wall that extends from the peripheral portion and that surrounds the base part,
• a first protruding portion protruding from the peripheral portion toward a main surface of the base part and inserted into the through-hole, and
• a pair of second protruding portions protruding from the side wall toward a side surface of the base part,
• wherein the first protruding portion has an outer periphery that follows a shape of an inner periphery of the through-hole, the outer periphery having a clearance from the inner periphery of the through-hole,
• the pair of second protrusions are opposite to a second short side of the pair of short sides and a first long side of the pair of long sides, respectively, such that the pair of second protrusions sandwich a corner located diagonal to one corner of the four corners of the base part that is closest to the through-hole, and
• a clearance between each second protruding portion of the pair of second protruding portions and the side surface of the base part is greater than the clearance from the inner periphery of the through-hole.