H10W 76/12
Characterised by their shape
Official title: characterised by their shape
H10W76/12 (Characterised by their shape) appears on 4,906 US grants and 5,111 published applications in this corpus.
Search patents in H10W- Granted patents
- 4,906
- Published applications
- 5,111
- Assignees
- 1,172
- Inventors
- 8,754
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 31 | 0 |
| 1977 | 19 | 0 |
| 1978 | 20 | 0 |
| 1979 | 24 | 0 |
| 1980 | 21 | 0 |
| 1981 | 32 | 0 |
| 1982 | 28 | 0 |
| 1983 | 27 | 0 |
| 1984 | 16 | 0 |
| 1985 | 31 | 0 |
| 1986 | 26 | 0 |
| 1987 | 40 | 0 |
| 1988 | 29 | 0 |
| 1989 | 43 | 0 |
| 1990 | 35 | 0 |
| 1991 | 51 | 0 |
| 1992 | 46 | 0 |
| 1993 | 35 | 0 |
| 1994 | 55 | 0 |
| 1995 | 49 | 0 |
| 1996 | 35 | 0 |
| 1997 | 41 | 0 |
| 1998 | 59 | 0 |
| 1999 | 47 | 0 |
| 2000 | 43 | 0 |
| 2001 | 54 | 24 |
| 2002 | 68 | 67 |
| 2003 | 72 | 66 |
| 2004 | 72 | 108 |
| 2005 | 69 | 105 |
| 2006 | 79 | 114 |
| 2007 | 77 | 113 |
| 2008 | 55 | 105 |
| 2009 | 76 | 98 |
| 2010 | 86 | 104 |
| 2011 | 70 | 114 |
| 2012 | 94 | 123 |
| 2013 | 117 | 151 |
| 2014 | 119 | 177 |
| 2015 | 170 | 236 |
| 2016 | 227 | 271 |
| 2017 | 236 | 290 |
| 2018 | 286 | 280 |
| 2019 | 287 | 295 |
| 2020 | 259 | 322 |
| 2021 | 241 | 337 |
| 2022 | 250 | 334 |
| 2023 | 240 | 408 |
| 2024 | 270 | 382 |
| 2025 | 276 | 303 |
| 2026 | 173 | 184 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- H10W 76/15Containers comprising an insulating or insulated base2,418
- H10W 76/13Containers comprising a conductive base serving as an interconnection1,428
- H10W 76/161Containers comprising no base147
- H10W 76/167The container walls comprising an aperture29
- H10W 76/165Characterised by interconnections through the top surface of the containers0
Recent patents
- Method for manufacturing and module of a semiconductor power module with heat dissipation function29 Sep 2026US 12,751,285 B2Hitachi Energy Ltd
- Semiconductor module29 Sep 2026US 12,751,318 B2Fuji Electric Co., Ltd.
- Electronic devices and methods of manufacturing electronic devices29 Sep 2026US 12,751,321 B2Amkor Technology Singapore Holding Pte.Ltd.
- Semiconductor device, power conversion device and moving body22 Sep 2026US 12,745,640 B2Mitsubishi Electric Corporation
- Package structure including a package lid having a plurality of fins and methods of forming the same15 Sep 2026US 12,740,411 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor package including connecting pads8 Oct 2026US 2026/0314451 A1Samsung Electronics Co., Ltd.
- Die attachment film, dicing die bonding film, and semiconductor device manufacturing method1 Oct 2026US 2026/0305443 A1Resonac Corporation
- Semiconductor module arrangement1 Oct 2026US 2026/0305489 A1Infineon Technologies AG
- Package structure and manufacturing method thereof24 Sep 2026US 2026/0293669 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Electromagnetic compartmental shielding for multichip cavity system-in-package (sip) module17 Sep 2026US 2026/0282931 A1Qorvo US, Inc.
Most cited
By later US patents
- Hermetically sealed electrical feedthrough for use with implantable electronic devices698US 5,750,926 AAlfred E. Mann Foundation for Scientific Research · 1998
- High-density electronic package, and method for making same437US 6,376,769 B1Amerasia International Technology, Inc. · 2002
- Leadless image sensor package structure and method for making the same353US 6,384,472 B1Siliconware Precision Industries Co., Ltd. · 2002
- Integrated circuit package having adhesive bead supporting planar lid above planar substrate332US 6,268,654 B1Ankor Technology, Inc. · 2001
- Method of making a cavity ball grid array apparatus317US 6,326,244 B1Micron Technology, Inc. · 2001