H10W 76/167
The container walls comprising an aperture
Official title: {the container walls comprising an aperture, e.g. for pressure control}
H10W76/167 (The container walls comprising an aperture) appears on 29 US grants and 40 published applications in this corpus.
Search patents in H10W- Granted patents
- 29
- Published applications
- 40
- Assignees
- 26
- Inventors
- 89
- Latest grant
- 11 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2006 | 0 | 1 |
| 2007 | 0 | 0 |
| 2008 | 0 | 1 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 1 |
| 2013 | 0 | 0 |
| 2014 | 2 | 2 |
| 2015 | 1 | 0 |
| 2016 | 0 | 0 |
| 2017 | 1 | 2 |
| 2018 | 1 | 4 |
| 2019 | 2 | 3 |
| 2020 | 3 | 5 |
| 2021 | 3 | 3 |
| 2022 | 3 | 2 |
| 2023 | 2 | 5 |
| 2024 | 4 | 6 |
| 2025 | 4 | 3 |
| 2026 | 3 | 2 |
By publication year. 2026 runs to 8 Oct.
Recent patents
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Most cited
By later US patents
- Package with shifted lead neck4US 11,211,320 B2Texas Instruments Incorporated · 2021
- Semiconductor device and mounting structure of semiconductor device3US 10,153,424 B2Rohm Co., Ltd. · 2018
- Light source device2US 11,262,060 B2Lite-On Opto Technology (Changzhou) Co., Ltd. · 2022
- Semiconductor device package and a method of manufacturing the same2US 11,862,525 B2Advanced Semiconductor Engineering, Inc. · 2024
- Method of chip package build-up2US 8,623,699 B2General Electric Company · 2014