Semiconductor package and manufacturing method thereof

A package structure, comprising:

• a circuit substrate,
• a package unit, disposed on the circuit substrate and electrically connected to the circuit substrate, wherein the package unit includes a first surface facing the circuit substrate and a second surface opposite to the first surface and away from the circuit substrate;
• a cover, disposed over the package unit and over the circuit substrate, wherein the cover is connected to the circuit substrate;
• a first adhesive, disposed on the circuit substrate and between the cover and the circuit substrate;
• a thermal interface material, disposed between the cover and the package unit and on the second surface;
• and
• a dielectric dam disposed between the cover and the package unit, wherein the thermal interface material physically contacts the dielectric dam, the cover and the second surface of the package unit.

A manufacturing method of a semiconductor structure, comprising:

• bonding a package unit to a circuit substrate, wherein the package unit is electrically connected with the circuit substrate and has a first surface facing the circuit substrate and a second surface opposite to the first surface and away from the circuit substrate;
• forming an adhesive on the circuit substrate;
• forming a dielectric dam on the circuit substrate and spaced apart from the adhesive and around the package unit;
• forming a thermal interface material on the second surface of the package unit;
• mounting and securing a cover over the adhesive on the circuit substrate;
• and
• performing a curing process to cure the thermal interface material, wherein the thermal interface material physically contacts the dielectric dam, the cover and the second surface of the package unit.