Semiconductor device and mounting structure of semiconductor device

A semiconductor device comprising:

• a semiconductor element that has a front surface and a back surface, the front surface and the back surface facing in opposite directions to each other in a thickness direction of the semiconductor element;
• a plurality of terminals that are disposed at a distance from the semiconductor element and are electrically connected to the front surface;
• and
• a sealing resin that has a first surface facing in a same direction as the direction in which the front surface faces, each of the plurality of terminals having a main surface exposed from the first surface,
• wherein one of the plurality of terminals includes a main surface conductive layer covering the main surface,
• the semiconductor device further comprises a heat dissipation layer that contacts the back surface,
• the sealing resin has a second surface that faces in an opposite direction to the direction in which the first surface faces,
• the heat dissipation layer is exposed from the second surface,
• one of the plurality of terminals has a first side surface and a second side surface, the first side surface facing an outside of the semiconductor device in a first direction orthogonal to the thickness direction of the semiconductor element, and the second side surface facing the outside in a second direction orthogonal to both the thickness direction of the semiconductor element and the first direction,
• the sealing resin has a third surface facing in the first direction and a fourth surface facing in the second direction,
• the first side surface is flush with the third surface, and
• the second side surface is flush with the fourth surface.

A semiconductor device comprising:

• a semiconductor element;
• a first electrical conductor spaced apart from the semiconductor element, the first electrical conductor being electrically connected to the semiconductor element;
• a second electrical conductor spaced apart from each of the semiconductor element and the first electrical conductor, the second electrical conductor being electrically connected to the semiconductor element;
• a sealing resin covering a part of the first electrical conductor and a part of the second electrical conductor,
• wherein the sealing resin includes a first surface and a second surface that faces an opposite side of the first surface,
• the first electrical conductor includes:
• a first end exposed from the first surface of the sealing resin, the first end of the first electrical conductor being flush with the first surface of the sealing resin;
• a second end exposed from the second surface of the sealing resin, the second end of the first electrical conductor being flush with the second surface of the sealing resin;
• and
• a connecting surface connecting the first end and the second end, the connecting surface of the first electrical conductor including a curved portion that is covered by the sealing resin, and
• the second electrical conductor includes:
• a first end exposed from the first surface of the sealing resin, the first end of the second electrical conductor being flush with the first surface of the sealing resin;
• a second end exposed from the second surface of the sealing resin, the second end of the second electrical conductor being flush with the second surface of the sealing resin;
• and
• a connecting surface connecting the first end and the second end, the connecting surface of the second electrical conductor including a curved portion that is covered by the sealing resin.