Semiconductor module

A semiconductor module, comprising:

• a laminate substrate including an insulating plate, and at least a first circuit board and a second circuit board arranged on an upper surface of the insulating plate;
• at least one first semiconductor device arranged on an upper surface of the first circuit board;
• a first main terminal;
• and
• a first metal wiring board that electrically connects the at least one first semiconductor device to the first main terminal, wherein
• the first metal wiring board has:
• at least one first bonding section bonded to an upper surface electrode of the at least one first semiconductor device;
• a second bonding section bonded to an upper surface of the second circuit board;
• at least one first coupling section that couples the at least one first bonding section to the second bonding section;
• and
• a first raised section that rises upward from an end portion of the second bonding section, the first raised section having an upper end that is electrically connected to the first main terminal;
• a third circuit board arranged on the upper surface of the insulating plate;
• at least one second semiconductor device arranged on an upper surface of the second circuit board;
• a second main terminal;
• and
• a second metal wiring board that electrically connects the at least one second semiconductor device to the second main terminal, wherein
• the second metal wiring board has:
• at least one third bonding section bonded to an upper surface electrode of the at least one second semiconductor device;
• a fourth bonding section bonded to an upper surface of the third circuit board;
• at least one second coupling section that couples the at least one third bonding section to the fourth bonding section;
• and
• a second raised section that rises upward from an end portion of the fourth bonding section, the second raised section having an upper end that is electrically connected to the second main terminal.

A semiconductor module, comprising:

• a laminate substrate including an insulating plate, and at least a first circuit board and a second circuit board arranged on an upper surface of the insulating plate;
• at least one first semiconductor device arranged on an upper surface of the first circuit board;
• a first main terminal;
• and
• a first metal wiring board that electrically connects the at least one first semiconductor device to the first main terminal, wherein
• the first metal wiring board has:
• at least one first bonding section bonded to an upper surface electrode of the at least one first semiconductor device;
• a second bonding section bonded to an upper surface of the second circuit board;
• at least one first coupling section that couples the at least one first bonding section to the second bonding section;
• and
• a first raised section that rises upward from one of two opposing ends of the second bonding section, the one end being opposite to the other end to which the at least one first coupling section is physically connected, the first raised section having an upper end that is electrically connected to the first main terminal.