Electronic device package including a gel
AssigneeMicrochip Technology Caldicot Limited
InventorsPiers Tremlett, Dan Chenery, Stylianos Syrigos
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Abstract
An electronic device package includes a frame, an electronic device mounted to the frame, surface-mount leads, and a gel at least partially filling a cavity between the electronic device and the frame. The electronic device includes electronic circuitry provided on an electronic device substrate, and the surface-mount leads are electrically connected to the electronic circuitry and extend laterally and outwardly from an outer perimeter of the frame. The gel in the cavity covers the electronic circuitry.
Claims17
A method of assembling an electronic device package, the method comprising:
- positioning a leadframe proximate an electronic device comprising electronic circuitry provided on an electronic device substrate, the leadframe including surface-mount leads extending from a leadframe lead carrier structure;
- affixing the surface-mount leads of the leadframe to the electronic device, wherein the surface-mount leads are electrically connected to the electronic circuitry;
- mounting the electronic device to a frame base defining a perimeter extending around the electronic device, wherein the surface-mount leads affixed to the electronic device extend outwardly from inside the perimeter of the frame base to outside the perimeter of the frame base;
- depositing a gel on the mounted electronic device;
- and
- securing a frame lid to the frame base, wherein the gel at least partially fills a cavity between the mounted electronic device and the frame lid.
A method of assembling an electronic device package, the method comprising:
- positioning a leadframe proximate an electronic device comprising electronic circuitry provided on an electronic device substrate, the leadframe including surface-mount leads extending from a leadframe lead carrier structure;
- affixing the surface-mount leads of the leadframe to the electronic device, wherein the surface-mount leads of the leadframe are electrically connected to the electronic circuitry;
- mounting the electronic device to a frame base defining a perimeter extending around the electronic device, wherein the surface-mount leads affixed to the electronic device extend outwardly from inside the perimeter of the frame base to outside the perimeter of the frame base, and wherein the electronic device and frame base define an open-sided cavity;
- at least partially filling the open-sided cavity with a gel, such that the gel at least partially covers the electronic circuitry of the electronic device;
- and
- securing a frame lid to the frame base to close the open-sided cavity and thereby enclose the gel in the closed cavity.
Dependencies are inferred from the claim text.