Package with shifted lead neck

A semiconductor package comprising:

• a pad and leads having a planar profile shaped from a planar base metal;
• a semiconductor die attached to the pad;
• a wire bond extending from the semiconductor die to a respective lead;
• and
• mold compound covering the semiconductor die, the wire bond, and a first portion of the respective lead, wherein a second portion of the respective lead extends beyond the mold compound through a surface of the mold compound,
• wherein a shape of the respective lead within the planar profile includes a lead neck within and adjacent to the mold compound and a lead leg adjacent to the lead neck and outside the mold compound,
• wherein the lead neck forms a first side at least partially within the mold compound, the first side extending at a first angle of 30 to 60 degrees relative to the surface of the mold compound through which the lead neck extends,
• wherein the lead neck forms a second side at least partially outside the mold compound, the second side adjacent the first side and extending at a second angle of 30 to 60 degrees relative to the surface of the mold compound through which the lead neck extends,
• wherein the lead neck forms a third side at least partially within the mold compound, the third side opposite the first side and extending at a third angle of 120 to 150 degrees relative to the surface of the mold compound through which the lead neck extends, and
• wherein the lead neck forms a fourth side at least partially outside the mold compound, the fourth side adjacent the second side and extending at a fourth angle of 120 to 150 degrees relative to the surface of the mold compound through which the lead neck extends.