Semiconductor device and method of manufacturing semiconductor device
AssigneeFuji Electric Co., Ltd.
InventorDaisuke INOUE
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AssigneeFuji Electric Co., Ltd.
InventorDaisuke INOUE
Estimating the term…
A semiconductor device, including: a circuit board; a case which includes a housing member with a rectangular outer shape in a plan view of the semiconductor device and houses the circuit board, the housing member including an upper surface portion having a lower surface thereof facing an upper surface of the housed circuit board with a gap therebetween, the upper surface portion including a first edge portion at an edge thereof in the plan view; a first external connection terminal that is held by the first edge portion and protrudes from the first edge portion in a direction that is perpendicular to an upper surface of the first edge portion; and an encapsulating member that encapsulates the gap between the upper surface of the circuit board and the lower surface of the upper surface portion.
A semiconductor device, comprising:
A method of manufacturing a semiconductor device, comprising:
Dependencies are inferred from the claim text.