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US 11,862,525 B2Granted
Semiconductor device package and a method of manufacturing the same
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsTsung-Yu Lin, Pei-Yu Wang, Chung-Wei Hsu
Life of this patent
Estimating the term…
Abstract
A semiconductor device package includes a supporting element, a transparent plate disposed on the supporting element, a semiconductor device disposed under the transparent plate, and a lid surrounding the transparent plate. The supporting element and the transparent plate define a channel.
Claims20
A semiconductor device package, comprising:
- a supporting element;
- and
- a plate supported by the supporting element, the plate including a top surface facing away from the supporting element;
- wherein the supporting element and the plate define an opening connected to the top surface of the plate and an outside of the semiconductor device package.
1 more element
A semiconductor device package, comprising:
- a carrier;
- a supporting element disposed over the carrier;
- a plate disposed over the supporting element, and
- an adhesive bonding the plate and the supporting element;
- wherein the carrier and the supporting element collectively define a cave, and a vertical projection of the cave on the carrier is within a vertical projection of the plate on the carrier;
- and
- wherein the supporting element, the adhesive and the plate collective define a gap configured to release fluid from the cave to outside of the semiconductor device package.
4 more elements
A semiconductor device package, comprising:
- a carrier;
- a supporting element disposed over the carrier;
- and
- a plate supported by the supporting element through an adhesive bonding the plate and the supporting element;
- wherein the plate, the supporting element, and the adhesive defines a cavity,
- wherein the plate and the supporting element define a gap configured to release air from the cavity to outside of the semiconductor device package.
3 more elements
Dependencies are inferred from the claim text.