Electromagnetic compartmental shielding for multichip cavity system-in-package (sip) module

Abstract

Aspects of the disclosure provide a semiconductor package and a method of producing the same. The disclosed semiconductor package includes a laminate; a plurality of wire bond dies attached to the laminate; and a lid attached to the laminate via a lid seal epoxy, the lid comprising a plurality of compartments configured to encase the plurality of wire bond dies and form cavities with each cavity encapsulating a wire bond die. In various embodiments, each compartment may include a first wall that is coated with an electromagnetic shielding material and a second wall that is free of the material coated on the first wall. In various embodiments, the lid may include a vent hole configured to release vapor pressure during attachment of the lid to the laminate. In various embodiments, a wireless device includes the disclosed semiconductor package.

Dependencies are inferred from the claim text.