Method of chip package build-up

A method of forming a chip package comprising:

• providing an initial polymer laminate layer;
• depositing a metallic shield element on one surface of the initial polymer laminate layer so as to cover a portion thereof;
• applying an adhesive layer to the initial polymer laminate layer and over the metallic shield element, the adhesive layer having a portion removed therefrom to form a window in the adhesive layer that corresponds substantially to a surface area of the metallic shield element and aligned therewith;
• adhering a die to the initial polymer laminate layer by way of the adhesive layer, the die being positioned over the window such a perimeter of the die is in contact with the adhesive layer and an air pocket is formed between a center portion of the die and the shield element;
• patterning the initial polymer laminate layer to include a plurality of vias and a plurality of metal interconnects, so as to electrically connect the initial polymer laminate layer to the die;
• defining a portion of the initial polymer laminate layer corresponding to the window in the adhesive layer;
• and
• removing the portion of the initial polymer laminate layer and the metallic shield element from the adhesive layer so as to expose a front surface of the die.