H10W 76/13
Containers comprising a conductive base serving as an interconnection
H10W76/13 (Containers comprising a conductive base serving as an interconnection) appears on 1,428 US grants and 1,414 published applications in this corpus.
Search patents in H10W- Granted patents
- 1,428
- Published applications
- 1,414
- Assignees
- 447
- Inventors
- 2,629
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 18 | 0 |
| 1977 | 13 | 0 |
| 1978 | 10 | 0 |
| 1979 | 14 | 0 |
| 1980 | 11 | 0 |
| 1981 | 14 | 0 |
| 1982 | 14 | 0 |
| 1983 | 15 | 0 |
| 1984 | 9 | 0 |
| 1985 | 14 | 0 |
| 1986 | 15 | 0 |
| 1987 | 12 | 0 |
| 1988 | 9 | 0 |
| 1989 | 14 | 0 |
| 1990 | 9 | 0 |
| 1991 | 12 | 0 |
| 1992 | 13 | 0 |
| 1993 | 9 | 0 |
| 1994 | 10 | 0 |
| 1995 | 8 | 0 |
| 1996 | 10 | 0 |
| 1997 | 8 | 0 |
| 1998 | 14 | 0 |
| 1999 | 14 | 0 |
| 2000 | 6 | 0 |
| 2001 | 14 | 7 |
| 2002 | 22 | 24 |
| 2003 | 17 | 24 |
| 2004 | 17 | 32 |
| 2005 | 15 | 28 |
| 2006 | 28 | 43 |
| 2007 | 21 | 34 |
| 2008 | 16 | 33 |
| 2009 | 22 | 22 |
| 2010 | 23 | 24 |
| 2011 | 20 | 26 |
| 2012 | 19 | 36 |
| 2013 | 34 | 63 |
| 2014 | 28 | 48 |
| 2015 | 64 | 72 |
| 2016 | 75 | 87 |
| 2017 | 75 | 99 |
| 2018 | 85 | 59 |
| 2019 | 74 | 88 |
| 2020 | 61 | 83 |
| 2021 | 75 | 85 |
| 2022 | 62 | 97 |
| 2023 | 61 | 102 |
| 2024 | 75 | 104 |
| 2025 | 79 | 61 |
| 2026 | 51 | 33 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- H10W 76/138Having another interconnection being formed by a cover plate parallel to the645
- H10W 76/134Having other interconnections parallel to the conductive base360
- H10W 76/136Having other interconnections perpendicular to the conductive base217
- H10W 76/132Having other interconnections through an insulated passage in the conductive base105
Recent patents
- Semiconductor device, power conversion device and moving body22 Sep 2026US 12,745,640 B2Mitsubishi Electric Corporation
- Power component and system with the power component25 Aug 2026US 12,716,963 B2ABB Schweiz AG
- Direct substrate-side cooling in power device module25 Aug 2026US 12,721,168 B2Semiconductor Components Industries, LLC
- Semiconductor device25 Aug 2026US 12,721,188 B2Fuji Electric Co., Ltd.
- Semiconductor device and method of manufacturing the same25 Aug 2026US 12,721,214 B2Denso Corporation
- Semiconductor device17 Sep 2026US 2026/0282978 A1Mitsubishi Electric Corporation
- Monolithic spring assemblies for high-frequency press-pack modules20 Aug 2026US 2026/0248017 A1
- Semiconductor devices and methods of manufacturing semiconductor devices20 Aug 2026US 2026/0248031 A1Amkor Technology Singapore Holding Pte.Ltd.
- Rf amplifier devices and methods of manufacturing including modularized designs with flip chip interconnections and integration into packaging6 Aug 2026US 2026/0230051 A1Wolfspeed, Inc.
- Device package wire bonding enhancements6 Aug 2026US 2026/0231823 A1
Most cited
By later US patents
- Low profile ball grid array package245US 6,172,419 B2Micron Technology, Inc. · 2001
- Solid printed substrate and electronic circuit package using the same239US 5,639,990 AMitsui Toatsu Chemicals, Inc. · 1997
- Microwave circuit package127US 5,847,453 AHonda Giken Kogyo Kabushiki Kaisha · 1998
- Semiconductor package104US 5,014,159 AOlin Corporation · 1991
- Thermally balanced leadless microelectronic circuit chip carrier96US 4,420,767 AZilog, Inc. · 1983