H10W 76/132
Having other interconnections through an insulated passage in the conductive base
Official title: having other interconnections through an insulated passage in the conductive base
H10W76/132 (Having other interconnections through an insulated passage in the conductive base) appears on 105 US grants and 91 published applications in this corpus.
Search patents in H10W- Granted patents
- 105
- Published applications
- 91
- Assignees
- 75
- Inventors
- 197
- Latest grant
- 24 Feb 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 2 | 0 |
| 1978 | 1 | 0 |
| 1979 | 2 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 3 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 2 | 0 |
| 1986 | 3 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 1 | 0 |
| 1992 | 1 | 0 |
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 2 | 0 |
| 2000 | 0 | 0 |
| 2001 | 2 | 0 |
| 2002 | 2 | 0 |
| 2003 | 0 | 2 |
| 2004 | 1 | 3 |
| 2005 | 1 | 3 |
| 2006 | 2 | 6 |
| 2007 | 0 | 1 |
| 2008 | 5 | 9 |
| 2009 | 6 | 2 |
| 2010 | 3 | 3 |
| 2011 | 2 | 2 |
| 2012 | 3 | 1 |
| 2013 | 2 | 7 |
| 2014 | 3 | 5 |
| 2015 | 6 | 0 |
| 2016 | 5 | 4 |
| 2017 | 1 | 4 |
| 2018 | 4 | 5 |
| 2019 | 2 | 5 |
| 2020 | 6 | 12 |
| 2021 | 4 | 2 |
| 2022 | 7 | 9 |
| 2023 | 3 | 4 |
| 2024 | 4 | 1 |
| 2025 | 3 | 0 |
| 2026 | 2 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method for manufacturing busbar assembly24 Feb 2026US 12,562,557 B2Suncall Corporation
- Header for semiconductor package, and semiconductor package20 Jan 2026US 12,532,589 B2Shinko Electric Industries Co., Ltd.
- Header for semiconductor package23 Dec 2025US 12,506,042 B2Shinko Electric Industries Co., Ltd.
- Method for singulating components from a component composite, and component29 Apr 2025US 12,288,830 B2OSRAM Opto Semiconductors GmbH
- Header for an electric component18 Feb 2025US 12,230,937 B2Schott AG
- Power semiconductor module with shielding heat sink8 Jan 2026US 2026/0011656 A1IHI Corporation
- Electronic component package and the manufacturing method thereof8 Feb 2024US 2024/0047936 A1Arima Lasers Corp.
- Busbar assembly and method for manufacturing the same23 Nov 2023US 2023/0378736 A1Suncall Corporation
- Header for semiconductor package18 May 2023US 2023/0154818 A1Shinko Electric Industries Co., Ltd.
- Terminal, electronic component package, and manufacturing method of terminal6 Apr 2023US 2023/0106356 A1Murata Manufacturing Co., Ltd.
Most cited
By later US patents
- Microwave circuit package127US 5,847,453 AHonda Giken Kogyo Kabushiki Kaisha · 1998
- Semiconductor process using lapped substrate and lapped low resistivity semiconductor carrier58US 4,141,135 AThomson-CSF · 1979
- Hermetic glass-metal compression seal51US 4,128,697 ACorning Glass Works · 1978
- Fan out wafer level package type semiconductor package and package on package type semiconductor package including the same47US 10,153,219 B2Samsung Electronics Co., Ltd. · 2018
- Semiconductor device package45US 7,327,015 B2Advanced Semiconductor Engineering, Inc. · 2008