Header for semiconductor package
AssigneeShinko Electric Industries Co., Ltd.
InventorKatsuya NAKAZAWA
Life of this patent
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Abstract
A header for a semiconductor package, includes an eyelet having a first surface, a second surface opposite to the first surface, a side surface, and a through hole penetrating the eyelet from the first surface to the second surface, a lead inserted through the through hole, and a metal base bonded to the second surface of the eyelet. The lead is bent at the second surface of the eyelet and protrudes from the side surface of the eyelet in a plan view. The metal base is spaced apart from the lead. The lead, located at a position overlapping the eyelet in the plan view, is disposed within a thickness range of the metal base in a side view.
Claims10
A header for a semiconductor package, comprising:
- an eyelet having a first surface, a second surface opposite to the first surface, a side surface, and a first through hole penetrating the eyelet from the first surface to the second surface;
- a lead inserted through the first through hole;
- and
- a metal base bonded to the second surface of the eyelet, wherein
- the lead is bent at the second surface of the eyelet and protrudes from the side surface of the eyelet in a plan view,
- the metal base is spaced apart from the lead, and
- the lead, located at a position overlapping the eyelet in the plan view, is disposed within a thickness range of the metal base in a side view.
Dependencies are inferred from the claim text.