Header for semiconductor package
AssigneeShinko Electric Industries Co., Ltd.
InventorKatsuya Nakazawa
Life of this patent
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Abstract
A header for a semiconductor package, includes an eyelet having a first surface, a second surface opposite to the first surface, a side surface, and a through hole penetrating the eyelet from the first surface to the second surface, a lead inserted through the through hole, and a metal base bonded to the second surface of the eyelet. The lead is bent at the second surface of the eyelet and protrudes from the side surface of the eyelet in a plan view. The metal base is spaced apart from the lead. The lead, located at a position overlapping the eyelet in the plan view, is disposed within a thickness range of the metal base in a side view.
Claims13
A header for a semiconductor package, comprising:
- an eyelet having a first surface, a second surface opposite to the first surface, a side surface, and a pair of first through holes penetrating the eyelet from the first surface to the second surface;
- a pair of leads inserted through the pair of first through holes, respectively;
- and
- a metal base bonded to the second surface of the eyelet, wherein:
- the pair of leads is bent at the second surface of the eyelet and protrudes in parallel in a predetermined direction from the side surface of the eyelet in a plan view,
- the metal base is spaced apart from the pair of leads,
- the metal base includes a portion disposed on the second surface and extending in the predetermined direction between bent portions of the pair of leads in the plan view, and
- the pair of leads, located at a position overlapping the eyelet in the plan view, is disposed within a thickness range of the metal base from the second surface in a side view.
Dependencies are inferred from the claim text.