Header for an electric component

An electronic component, comprising:

• a header having a base, a first feedthrough pin, a second feedthrough pin, a pedestal, and two submounts, the base has a first electrical feedthrough and a second electrical feedthrough, wherein the first and second feedthrough pins extend through the base at the first and second electrical feedthroughs, respectively, and are electrically isolated to the base within the first and second electrical feedthroughs, respectively, wherein the pedestal connected to the base, and wherein the two submounts each comprising a carrier with a structured conductor plating, the structured conductor plating comprising at least two conductor traces, with one of the at least two conductor traces of each of the two submounts being electrically connected to one of the first and second feedthrough pins, wherein the two submounts have an identical structure but are mounted onto the pedestal so that a first submount is flipped with respect to a second submount, the structured conductor plating has a pattern that is a mirror symmetrical with respect to a symmetry plane, and the symmetry plane is located between two opposite ends of each of the two submounts;
• an electronic device on the header;
• a housing enclosing the electronic device and the header;
• and
• a cap attached to the header so that a cavity is provided with the electronic device arranged within the cavity.

A header for an electronic component, comprising:

• a base having a first electrical feedthrough and a second electrical feedthrough;
• a first feedthrough pin in the first electrical feedthrough;
• a second feedthrough pin in the second electrical feedthrough, wherein the first and second feedthrough pins extend through the base and are electrically isolated to the base within the first and second electrical feedthroughs, respectively;
• a pedestal connected to the base;
• two submounts each comprising a carrier with a structured conductor plating, the structured conductor plating comprising at least two conductor traces, with one of the at least two conductor traces of each of the two submounts being electrically connected to one of the first and second feedthrough pins;
• and
• a feature selected from a group consisting of:
• a further conductor trace arranged between limbs of a U-shaped conductor trace;
• a further conductor trace arranged between a limb of a U-shaped conductor trace and an end of one of the two submounts proximal to the limb;
• a widened end a conductor trace of the two submounts that is distal to an end connected to the first and second feedthrough pins, respectively;
• a device submount for mounting the electronic device;
• and a head of the first and second feedthrough pins, respectively, is formed and positioned so as to reduce a distance of the feedthrough pins to the conductor plating,
• wherein the two submounts are equally formed but mounted in different orientations.