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US 7,327,015 B2Granted
Semiconductor device package
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsJunYoung Yang, KiDon Kim, JongHo Han, JunHong Lee
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Abstract
A semiconductor device package includes a semiconductor device mounted to a substrate, a wall erected around the semiconductor device with a height taller than the height of the semiconductor device, at least one metal member provided in the wall or against the wall; and a lid secured to the metal member. The metal member and the lid enclose substantially the semiconductor device for providing electromagnetic interference shielding.
Claims10
A semiconductor device package comprising:
- a substrate;
- a semiconductor device mounted to the substrate and electrically coupled to the substrate;
- a wall erected around the semiconductor device with a height taller than the height of the semiconductor device;
- at least one metal member provided in the wall;
- and
- a lid secured to the metal member such that the lid is electrically connected to the metal member directly,
- wherein the metal member and the lid substantially enclose the semiconductor device for providing electromagnetic interference shielding.
4 more elements
Dependencies are inferred from the claim text.