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US 12,721,168 B2Granted
Direct substrate-side cooling in power device module
AssigneeSemiconductor Components Industries, LLC
InventorsAtapol Prajuckamol, Chee Hiong Chew, Yushuang Yao
Life of this patent
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Abstract
A method includes disposing at least one power device between a first direct bonded metal (DBM) substrate and a second DMB substrate and thermally coupling a plurality of pipes to a top side of the first DBM substrate opposite a side of the first DBM substrate with the at least one power device. The plurality of pipes is configured to carry cooling fluids in thermal contact with the first DBM substrate.
Claims21
A package, comprising:
- at least one power device disposed between a first direct bonded metal (DBM) substrate and a second DBM substrate;
- a plurality of pipes, including a first pipe and a second pipe, thermally coupled to a top side of the first DBM substrate opposite a side of the first DBM substrate with the at least one power device, the plurality of pipes configured to include a cooling fluid therein;
- and
- a package casing, the first DBM substrate and the second DBM substrate being disposed within an interior cavity of the package casing, the first pipe and the second pipe being at least partially disposed within the interior cavity, wherein respective ends of the first pipe and the second pipe extend through a wall of the interior cavity to an exterior of the package casing.
1 more element
A power device module, comprising:
- at least one power device disposed between a direct bonded metal (DBM) substrate and a conductive strip of material;
- and
- a plurality of pipes, including a first pipe and a second pipe, thermally coupled to a top side of the conductive strip of material, the plurality of pipes configured to include a cooling fluid;
- and
- a package casing, the first DBM substrate and the conductive strip being disposed within an interior cavity of the package casing, the first pipe and the second pipe being at least partially disposed within the interior cavity, wherein respective ends of the first pipe and the second pipe extend through a wall of the interior cavity to an exterior of the package casing.
2 more elements
A method comprising:
- disposing at least one power device between a first direct bonded metal (DBM) substrate and a strip of conductive material in an interior cavity of a package casing;
- and
- thermally coupling a plurality of pipes including a first pipe and a second pipe to a top side of the strip of conductive material, the plurality of pipes configured to include cooling fluids in thermal contact with the strip of conductive material, the first pipe and the second pipe being at least partially disposed within the interior cavity, wherein respective ends of the first pipe and the second pipe extend through a wall of the interior cavity to an exterior of the package casing.
A method comprising:
- disposing at least one power device between a first direct bonded metal (DBM) substrate and a second DMB substrate in an interior cavity of a package casing;
- thermally coupling a plurality of pipes including a first pipe and a second pipe to a top side of the first DBM substrate, the plurality of pipes configured to include cooling fluids in thermal contact with the first DBM substrate, the first pipe and the second pipe being at least partially disposed within the interior cavity, wherein respective ends of the first pipe and the second pipe extend through a wall of the interior cavity to an exterior of the package casing;
- and
- thermally coupling a base plate to a bottom side of the second DMB substrate.
1 more element
Dependencies are inferred from the claim text.