H10W 76/134
Having other interconnections parallel to the conductive base
Official title: having other interconnections parallel to the conductive base
H10W76/134 (Having other interconnections parallel to the conductive base) appears on 360 US grants and 374 published applications in this corpus.
Search patents in H10W- Granted patents
- 360
- Published applications
- 374
- Assignees
- 165
- Inventors
- 665
- Latest grant
- 11 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 3 | 0 |
| 1980 | 1 | 0 |
| 1981 | 2 | 0 |
| 1982 | 2 | 0 |
| 1983 | 5 | 0 |
| 1984 | 5 | 0 |
| 1985 | 4 | 0 |
| 1986 | 2 | 0 |
| 1987 | 6 | 0 |
| 1988 | 2 | 0 |
| 1989 | 3 | 0 |
| 1990 | 1 | 0 |
| 1991 | 2 | 0 |
| 1992 | 2 | 0 |
| 1993 | 2 | 0 |
| 1994 | 4 | 0 |
| 1995 | 2 | 0 |
| 1996 | 2 | 0 |
| 1997 | 1 | 0 |
| 1998 | 0 | 0 |
| 1999 | 2 | 0 |
| 2000 | 1 | 0 |
| 2001 | 0 | 1 |
| 2002 | 5 | 6 |
| 2003 | 3 | 12 |
| 2004 | 6 | 5 |
| 2005 | 4 | 13 |
| 2006 | 9 | 20 |
| 2007 | 9 | 7 |
| 2008 | 6 | 10 |
| 2009 | 7 | 10 |
| 2010 | 10 | 8 |
| 2011 | 10 | 6 |
| 2012 | 1 | 19 |
| 2013 | 13 | 15 |
| 2014 | 14 | 11 |
| 2015 | 14 | 24 |
| 2016 | 23 | 17 |
| 2017 | 18 | 22 |
| 2018 | 20 | 11 |
| 2019 | 16 | 20 |
| 2020 | 11 | 24 |
| 2021 | 21 | 23 |
| 2022 | 17 | 38 |
| 2023 | 19 | 27 |
| 2024 | 29 | 8 |
| 2025 | 11 | 9 |
| 2026 | 5 | 8 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Package with molding cavity11 Aug 2026US 12,708,024 B2Semiconductor Components Industries, LLC
- Semiconductor device and method for producing semiconductor device21 Jul 2026US 12,690,489 B2Kabushiki Kaisha Toshiba
- RF amplifier devices and methods of manufacturing including modularized designs with flip chip interconnections and integration into packaging2 Jun 2026US 12,647,083 B2Wolfspeed, Inc.
- Semiconductor device24 Mar 2026US 12,588,571 B2Mitsubishi Electric Corporation
- Semiconductor device, package for semiconductor device, and method for manufacturing package for semiconductor device13 Jan 2026US 12,525,510 B2Sumitomo Electric Device Innovations, Inc.
- Semiconductor device17 Sep 2026US 2026/0282978 A1Mitsubishi Electric Corporation
- Rf amplifier devices and methods of manufacturing including modularized designs with flip chip interconnections and integration into packaging6 Aug 2026US 2026/0230051 A1Wolfspeed, Inc.
- Inverter housing comprising cooling pads and inverter comprising such a housing16 Jul 2026US 2026/0204989 A1Nidec Psa Emotors
- Semiconductor device9 Jul 2026US 2026/0198373 A1Denso Corporation
- Semiconductor device11 Jun 2026US 2026/0165195 A1Fuji Electric Co., Ltd.
Most cited
By later US patents
- Semiconductor package104US 5,014,159 AOlin Corporation · 1991
- Thermally balanced leadless microelectronic circuit chip carrier96US 4,420,767 AZilog, Inc. · 1983
- Casing for an electrical component having improved strength and heat transfer characteristics70US 4,410,927 AOlin Corporation · 1983
- Lead frame and chip carrier housing66US 4,195,193 AAMP Incorporated · 1980
- Stackable package having a cavity and a lid for an electronic device66US 6,518,659 B1Amkor Technology, Inc. · 2003