Package with molding cavity
AssigneeSemiconductor Components Industries, LLC
InventorsYong Liu, Liangbiao Chen, Chee Hiong Chew
Life of this patent
Estimating the term…
Abstract
A high-power semiconductor device module is implemented with a cavity in the molding package. The cavity reduces a volume of the molding compound, preventing an accumulation of stress in the module, and associated warpage of the package. Chip assemblies within the module are designed to fit within the cavity, so that semiconductor dies, and sensing devices therein are protected from damage during a sintering process in which the module is mounted to a heat sink. After the sintering process, the cavity can be sealed with a gel material. The molding package described herein can also enhance reliability of the module during operation, ensuring that the product is robust for electric and hybrid electric vehicle applications.
Claims20
An apparatus, comprising:
- a substrate;
- a chip assembly coupled to the substrate, the chip assembly including a semiconductor die;
- a sense pad attached to the substrate and electrically coupled to the chip assembly;
- a molding package formed around the chip assembly and the substrate, the molding package having a cavity including a gel material, wherein the molding package is disposed on a first portion of an upper surface of the sense pad and the gel material is disposed on a second portion of the upper surface of the sense pad;
- a mounting bracket attached to the substrate;
- and
- a lead that provides a signal path from an external device to the semiconductor die.
An apparatus, comprising:
- a substrate;
- a power inverter circuit coupled to the substrate;
- a sense pad attached to the substrate and electrically coupled to the power inverter circuit;
- and
- a molding package formed around the power inverter circuit and the substrate, the molding package having a cavity formed therein, wherein the cavity is filled with a gel material, and wherein the molding package is disposed on a first portion of an upper surface of the sense pad and the gel material is disposed on a second portion of the upper surface of the sense pad.
A method, comprising:
- attaching a chip assembly, including a semiconductor die, to a substrate;
- attaching a clip between the chip assembly and the substrate;
- attaching a wire bond between the chip assembly and a sense pad on the substrate;
- forming a molded package around the substrate to form a module, the molded package including a cavity that exposes the chip assembly, the clip, and a first portion of an upper surface of the sense pad, the molded package being disposed on a second portion of the upper surface of the sense pad;
- sintering the module to a base;
- and
- disposing a gel material in the cavity after sintering the module to the base, wherein the gel material is disposed on the first portion of the upper surface of the sense pad.
Dependencies are inferred from the claim text.