Semiconductor device, package for semiconductor device, and method for manufacturing package for semiconductor device

A package for a semiconductor device comprising:

• a base plate having a first region and a second region surrounding the first region, the base plate comprising a metal;
• a wall portion having a first frame body provided on the second region and a second frame body provided on the first frame body, the first frame body comprising a metal, the second frame body comprising a resin;
• a first metal film provided on the second frame body;
• and
• a lead portion conductively bonded to the first metal film,
• wherein the first frame body is conductively bonded to the base plate,
• wherein a thickness of the first frame body in a first direction that is a direction in which the first frame body and the second frame body are arranged is larger than a thickness of the first metal film in the first direction,
• wherein the lead portion has:
• a lead frame including a first main surface facing the second frame body and a second main surface facing opposite to the first main surface, the lead frame comprising a resin;
• a second metal film provided on the first main surface and conductively bonded to the first metal film;
• and
• a third metal film provided on the second main surface;
• and
• wherein the lead frame includes a plurality of vias electrically connecting the second metal film and the third metal film to each other.