Thermally balanced leadless microelectronic circuit chip carrier
AssigneeZilog, Inc.
InventorsRobin H. Hodge, Mark A. Brodsky
Life of this patent
Estimating the term…
Abstract
A thermally balanced leadless microelectronic circuit chip carrier in which the chip is mounted directly on a heat sinking member by means of a conductive stress relieving polyimide. The heat sinking member, which has a support surface for the chip and an extending threaded shaft, is held by a carrier member thermally compatible with the surface on which the package is to be used. The shaft passes through the carrier member and receiving surface to a heat sinking nut which holds the package to the receiving surface. Leads on the carrier member surface are used to connect the receiving surface to the wires bonded to the chip contacts.
Claims24
A heat sinking thermally balanced microelectronic circuit chip package, comprising:
- a high thermal conductivity member serving as a base for attachment of the chip thereto and for conducting heat from said chip,
- a heat conductive, thermal expansion stress relieving mounting material attaching said chip to said conductive member, and
- a substantially rigid electrically insulative carrier member attached to said conductive member adjacent said chip, but without any substantial contact with the chip or mounting material, said carrier extending outward of said conductive member and including a plurality of electrically conductive leads carried thereby for allowing electrical connection between said chip and a receiving surface.
A microelectronic circuit chip package, comprising:
- an elongated base member characterized by having a high level of thermal conducivity,
- a microelectronic circuit chip attached to one end of said base member in a heat conductive manner, whereby heat generated by said chip is carried by the base member to another end thereof,
- an electrically and thermally insulative carrier member surrounding and extending outward from said base member adjacent its said one end in a direction substantially orthogonal with a longitudinal axis of the base member between its said one and another ends, said carrier and said circuit chip not touching each other, and
- a plurality of electrical contacts attached to said carrier member that are electrically connected to said circuit chip by electrically conductive leads extending therebetween.
Dependencies are inferred from the claim text.