Stackable package having a cavity and a lid for an electronic device

A package for an electronic device comprising:

• a package body having a first surface, side surfaces extending vertically from said first surface, and a hollow central cavity having an opening opposite said first surface;
• an electronic device within said cavity;
• a lid over said opening;
• and
• a plurality of leads electrically connected to the electronic device, each said lead having a first portion adjacent the first surface of the package body, a second portion extending vertically adjacent to a peripheral side surface of the package body, and a third portion adjacent to and extending over the lid;
• wherein the package body is formed of a plastic encapsulant, the first portion of each of the leads is embedded in the encapsulant adjacent the first surface of the package body, and the embedded first portion of the lead has a first surface exposed at the first surface of the package body.

A package for an electronic device comprising:

• a package body formed of a molded encapsulant material, said package body having a first surface, side surfaces extending vertically from said first surface, and a hollow central cavity having an opening opposite said first surface;
• an electronic device within said cavity;
• a hardened second encapsulant material within said cavity and covering the electronic device;
• and
• a plurality of leads electrically connected to the electronic device, each said lead having a first portion embedded at the first surface of the package body, a second portion extending vertically adjacent to a peripheral side surface of the package body, and a third portion adjacent to and extending over the hardened second encapsulant material, wherein a surface of the embedded first portion of each lead is exposed at the first surface of the package body.

A stackable package for an electronic device comprising:

• a package body having a first surface, side surfaces extending vertically from said first surface, and a hollow central cavity having an opening opposite said first surface, wherein the electronic device is within said cavity;
• a lid over said opening;
• a member extending integrally from said lid;
• a plurality of leads electrically connected to the electronic device, each said lead having a first portion adjacent the first surface of the package body, a second portion extending vertically adjacent to a peripheral side surface of the package body, and a third portion adjacent to and extending over the lid.