H10W 76/136
Having other interconnections perpendicular to the conductive base
Official title: having other interconnections perpendicular to the conductive base
H10W76/136 (Having other interconnections perpendicular to the conductive base) appears on 217 US grants and 213 published applications in this corpus.
Search patents in H10W- Granted patents
- 217
- Published applications
- 213
- Assignees
- 82
- Inventors
- 474
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 3 | 0 |
| 1978 | 1 | 0 |
| 1979 | 2 | 0 |
| 1980 | 3 | 0 |
| 1981 | 5 | 0 |
| 1982 | 5 | 0 |
| 1983 | 0 | 0 |
| 1984 | 2 | 0 |
| 1985 | 3 | 0 |
| 1986 | 3 | 0 |
| 1987 | 2 | 0 |
| 1988 | 2 | 0 |
| 1989 | 2 | 0 |
| 1990 | 1 | 0 |
| 1991 | 2 | 0 |
| 1992 | 3 | 0 |
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 2 | 0 |
| 1996 | 3 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 1 | 0 |
| 2000 | 2 | 0 |
| 2001 | 2 | 1 |
| 2002 | 3 | 6 |
| 2003 | 2 | 2 |
| 2004 | 1 | 2 |
| 2005 | 0 | 3 |
| 2006 | 4 | 1 |
| 2007 | 0 | 2 |
| 2008 | 0 | 3 |
| 2009 | 1 | 1 |
| 2010 | 1 | 2 |
| 2011 | 0 | 7 |
| 2012 | 4 | 5 |
| 2013 | 5 | 14 |
| 2014 | 7 | 14 |
| 2015 | 14 | 12 |
| 2016 | 11 | 13 |
| 2017 | 11 | 14 |
| 2018 | 11 | 10 |
| 2019 | 13 | 15 |
| 2020 | 11 | 10 |
| 2021 | 13 | 19 |
| 2022 | 13 | 16 |
| 2023 | 14 | 22 |
| 2024 | 8 | 3 |
| 2025 | 13 | 10 |
| 2026 | 4 | 6 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Semiconductor device, power conversion device and moving body22 Sep 2026US 12,745,640 B2Mitsubishi Electric Corporation
- Semiconductor device4 Aug 2026US 12,702,054 B2Fuji Electric Co., Ltd.
- Semiconductor device, power converter, and moving vehicle28 Jul 2026US 12,696,795 B2Mitsubishi Electric Corporation
- Semiconductor apparatus comprising lead frame with recess for wires, and vehicle using the same27 Jan 2026US 12,538,798 B2Fuji Electric Co., Ltd.
- Semiconductor apparatus2 Dec 2025US 12,489,095 B2Fuji Electric Co., Ltd.
- Semiconductor device and vehicle28 May 2026US 2026/0150678 A1Fuji Electric Co., Ltd.
- Semiconductor device23 Apr 2026US 2026/0114318 A1Sumitomo Electric Industries, Ltd.
- Semiconductor device, semiconductor module, and method of manufacturing semiconductor device26 Feb 2026US 2026/0060059 A1Fuji Electric Co., Ltd.
- Semiconductor device12 Feb 2026US 2026/0047177 A1Mitsubishi Electric Corporation
- Semiconductor device8 Jan 2026US 2026/0011625 A1Fuji Electric Co., Ltd.
Most cited
By later US patents
- Semiconductor power package module77US 6,774,465 B2Fairchild Korea Semiconductor Ltd. · 2004
- Hermetic power chip packages51US 4,646,129 AGeneral Electric Company · 1987
- Semiconductor device having power semiconductor elements51US 5,956,231 AHitachi Haramachi Electronics Co., Ltd. · 1999
- Semiconductor device37US 6,434,008 B1Hitachi Haramachi Electronics Co., Ltd. · 2002
- Hermetic package having a lead extending through an aperture in the package lid and packaged semiconductor chip36US 5,103,290 AGeneral Electric Company · 1992