Semiconductor device

A semiconductor device comprising:

• a SiC semiconductor element mounted on a multilayer substate and an electrically conductive connection member;
• and
• a sealant that seals the SiC semiconductor element and the electrically conductive connection member, containing:
• a matrix resin containing an epoxy resin base material,
• an inorganic filler and
• an ultraviolet light absorbent,
• wherein
• the ultraviolet light absorbent is an organic material having an average particle size of 10 nm to 5000 nm, which absorbs 30% or more of ultraviolet light having a wavelength of 370 nm emitted from the SiC semiconductor element, and
• the content of the ultraviolet light absorbent is 0.1 parts to 10 parts by mass relative to 100 parts by mass of the matrix resin, and
• the content of the inorganic filler is 200 parts to 400 parts by mass, relative to 100 parts by mass of the matrix resin.