Semiconductor device
AssigneeSumitomo Electric Industries, Ltd.
InventorsTomoki IKEDA, Yoshisumi KAWABATA
Life of this patent
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Abstract
A semiconductor device includes: a substrate with a circuit pattern: a semiconductor chip mounted on the circuit pattern and electrically connected to the circuit pattern; a frame member including a wall portion; and a plate-shaped terminal electrically connected to the circuit pattern. The wall portion surrounds the substrate. The terminal includes a first region attached to the wall portion, and a second region continuous to the first region and located inside the frame member. A distance between an inner wall surface of the wall portion and the circuit pattern is 500 μm or less. The second region is directly connected to the circuit pattern.
Claims20
A semiconductor device comprising:
- a substrate with a circuit pattern;
- a semiconductor chip mounted on the circuit pattern and electrically connected to the circuit pattern;
- a frame member including a wall portion;
- and
- a plate-shaped terminal electrically connected to the circuit pattern, wherein the wall portion surrounds the substrate,
- the terminal includes
- a first region attached to the wall portion, and
- a second region located inside the frame member,
- a distance between an inner wall surface of the wall portion and the circuit pattern is 500 μm or less, and
- the second region is directly connected to the circuit pattern.
A semiconductor device comprising:
- a substrate with a circuit pattern;
- a semiconductor chip mounted on the circuit pattern and electrically connected to the circuit pattern;
- a frame member including a wall portion;
- and
- a plate-shaped terminal electrically connected to the circuit pattern, wherein
- the wall portion surrounds the substrate,
- terminal includes
- a third region attached to the wall portion,
- a fourth region located inside the frame member and directly connected to the circuit pattern, and
- a fifth region located between the third region and the fourth region,
- a distance between an inner wall surface of the wall portion and the circuit pattern is 500 μm or less, and
- a gap is present between the fifth region and the circuit pattern, and
- the fifth region includes a through hole penetrating the substrate in a thickness direction of the substrate.
Dependencies are inferred from the claim text.