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US 12,538,798 B2Granted
Semiconductor apparatus comprising lead frame with recess for wires, and vehicle using the same
AssigneeFuji Electric Co., Ltd.
InventorsHitoshi Nakata, Yuichiro Hinata, Naoyuki Kanai
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Abstract
A semiconductor apparatus includes a substrate, a semiconductor device arranged on an upper surface of the substrate, a lead frame bonded to an upper surface of the semiconductor device via a bonding material, the lead frame having a first recess on an upper surface thereof, a wire connected to the first recess, and a resin that seals the substrate, the semiconductor device, the lead frame, and the wire.
Claims11
A semiconductor apparatus, comprising:
- a substrate;
- a semiconductor device arranged on an upper surface of the substrate;
- a lead frame bonded to an upper surface of the semiconductor device via a bonding material, the lead frame having a first recess on an upper surface thereof;
- a wire connected to the first recess;
- and
- a resin that seals the substrate, the semiconductor device, the lead frame, and the wire, wherein
- one end of the wire is connected to not only the bottom surface of the first recess but also a side surface that extends in a longitudinal direction of the first recess.
4 more elements
Dependencies are inferred from the claim text.