Semiconductor device, power converter, and moving vehicle
AssigneeMitsubishi Electric Corporation
InventorsYoichi Hironaka, Tatsunori Yanagimoto
Life of this patent
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Abstract
The present disclosure has been conceived to solve such a problem, and it is an object of the present disclosure to provide a semiconductor device enabling reduction in cost. A semiconductor device according to the present disclosure includes: a base plate; an insulating substrate disposed over the base plate; a semiconductor chip disposed over the insulating substrate; a first resin case and a second resin case attached to the base plate to enclose the insulating substrate and the semiconductor chip, and fitted together; and a sealing material to seal the insulating substrate and the semiconductor chip, wherein the first resin case and the second resin case are formed of resin materials having different comparative tracking indices.
Claims17
A semiconductor device comprising:
- a base plate;
- an insulating substrate disposed over the base plate;
- a semiconductor chip disposed over the insulating substrate;
- a first resin case and a second resin case attached to the base plate to enclose the insulating substrate and the semiconductor chip, and fitted together;
- and
- a sealing material to seal the insulating substrate and the semiconductor chip, wherein
- the first resin case and the second resin case are formed of resin materials having different comparative tracking indices,
- an entirety of the first resin case is spaced from the base plate by way of the second resin case, and
- the first resin case and the second resin case are fitted by a recess and protrusion structure such that the first resin case includes a first protrusion that protrudes in a vertical direction such that the first protrusion overlaps a first recess in the second resin case in the vertical direction.
Dependencies are inferred from the claim text.