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US 6,774,465 B2Granted
Semiconductor power package module
AssigneeFairchild Korea Semiconductor Ltd.
InventorsKeun hyuk Lee, Ji-hwan Kim, Dae-woong Chung, O-seob Jeon
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AssigneeFairchild Korea Semiconductor Ltd.
InventorsKeun hyuk Lee, Ji-hwan Kim, Dae-woong Chung, O-seob Jeon
Estimating the term…
A semiconductor power module in which a power circuit chip and a control circuit chip are integrated in a package, is provided. The semiconductor power module includes a case; a terminal inserted into the case, the terminal including portions protruding upward to the outside of the case, and portions exposed in the case; a first substrate to which the power circuit chip is attached, the first substrate attached to the case for encapsulating the bottom of the package; a second substrate to which the control circuit chip is attached, the second substrate being spaced from the first substrate at a predetermined interval in a perpendicular direction in the case; and a cover for covering the top of the case, and for encapsulating the top of the package.
A semiconductor power module in which a power circuit chip and a control circuit chip are integrated in a package, the semiconductor power module comprising:
A semiconductor power module in which a power circuit chip and a control circuit chip are integrated in a package, the semiconductor power module comprising:
A semiconductor power module in which a power circuit chip and a control circuit chip are integrated in a package, the semiconductor power module comprising:
A semiconductor power module in which a power circuit chip and a control circuit chip are integrated in a package, the semiconductor power module comprising:
A semiconductor power module in which a power circuit chip and a control circuit chip are integrated in a package, the semiconductor power module comprising:
A semiconductor power module in which a power circuit chip and a control circuit chip are integrated in a package, the semiconductor power module comprising:
A semiconductor power module in which a power circuit chip and a control circuit chip are integrated in a package, the semiconductor power module comprising:
A semiconductor power module in which a power circuit chip and a control circuit chip are integrated in a package, the semiconductor power module comprising;
A semiconductor power module in which a power circuit chip and a control circuit chip are integrated in a package, the semiconductor power module comprising:
Dependencies are inferred from the claim text.