H10W 76/138
Having another interconnection being formed by a cover plate parallel to the
Official title: having another interconnection being formed by a cover plate parallel to the conductive base, e.g. sandwich type
H10W76/138 (Having another interconnection being formed by a cover plate parallel to the) appears on 645 US grants and 609 published applications in this corpus.
Search patents in H10W- Granted patents
- 645
- Published applications
- 609
- Assignees
- 216
- Inventors
- 1,200
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 12 | 0 |
| 1977 | 8 | 0 |
| 1978 | 7 | 0 |
| 1979 | 8 | 0 |
| 1980 | 7 | 0 |
| 1981 | 6 | 0 |
| 1982 | 4 | 0 |
| 1983 | 9 | 0 |
| 1984 | 3 | 0 |
| 1985 | 4 | 0 |
| 1986 | 6 | 0 |
| 1987 | 5 | 0 |
| 1988 | 5 | 0 |
| 1989 | 7 | 0 |
| 1990 | 7 | 0 |
| 1991 | 7 | 0 |
| 1992 | 7 | 0 |
| 1993 | 5 | 0 |
| 1994 | 6 | 0 |
| 1995 | 4 | 0 |
| 1996 | 5 | 0 |
| 1997 | 6 | 0 |
| 1998 | 10 | 0 |
| 1999 | 9 | 0 |
| 2000 | 3 | 0 |
| 2001 | 9 | 5 |
| 2002 | 12 | 11 |
| 2003 | 11 | 8 |
| 2004 | 7 | 21 |
| 2005 | 10 | 10 |
| 2006 | 13 | 17 |
| 2007 | 12 | 24 |
| 2008 | 5 | 9 |
| 2009 | 7 | 7 |
| 2010 | 8 | 9 |
| 2011 | 7 | 11 |
| 2012 | 8 | 7 |
| 2013 | 12 | 24 |
| 2014 | 6 | 14 |
| 2015 | 22 | 26 |
| 2016 | 27 | 43 |
| 2017 | 29 | 47 |
| 2018 | 40 | 25 |
| 2019 | 30 | 40 |
| 2020 | 29 | 27 |
| 2021 | 30 | 31 |
| 2022 | 20 | 26 |
| 2023 | 22 | 41 |
| 2024 | 29 | 81 |
| 2025 | 44 | 34 |
| 2026 | 36 | 11 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Power component and system with the power component25 Aug 2026US 12,716,963 B2ABB Schweiz AG
- Direct substrate-side cooling in power device module25 Aug 2026US 12,721,168 B2Semiconductor Components Industries, LLC
- Semiconductor device25 Aug 2026US 12,721,188 B2Fuji Electric Co., Ltd.
- Semiconductor device and method of manufacturing the same25 Aug 2026US 12,721,214 B2Denso Corporation
- Semiconductor device18 Aug 2026US 12,713,913 B2Dynex Semiconductor Limited
- Monolithic spring assemblies for high-frequency press-pack modules20 Aug 2026US 2026/0248017 A1
- Electric Circuit Body, Power Conversion Device, and Method for Manufacturing Electric Circuit Body30 Jul 2026US 2026/0223723 A1Astemo, Ltd.
- High power density flip chip semiconductor packaging30 Jul 2026US 2026/0223745 A1Dynex Semiconductor Limited
- Power module23 Jul 2026US 2026/0214806 A1Mitsubishi Electric Corporation
- Semiconductor device and power converter11 Jun 2026US 2026/0165121 A1Denso Corporation
Most cited
By later US patents
- Power electronic module packaging85US 6,377,461 B1General Electric Company · 2002
- Semiconductor device having radiation structure69US 6,703,707 B1Denso Corporation · 2004
- Moldless semiconductor device and photovoltaic device module making use of the same61US 6,316,832 B1Canon Kabushiki Kaisha · 2001
- Cooled semiconductor power module including structured strain buffers without dry interfaces48US 4,392,153 AGeneral Electric Company · 1983
- Power electronic module packaging46US 6,232,151 B1General Electric Company · 2001