Semiconductor device and power converter

A semiconductor device comprising:

• a semiconductor element including
• a first main electrode at a first surface of the semiconductor element, and
• a second main electrode at a second surface of the semiconductor element on a side opposite from the first surface in a thickness direction of the semiconductor element;
• a first wiring member connected to the first main electrode;
• a terminal having a first terminal surface connected to the second main electrode and a second terminal surface on a side opposite from the first terminal surface in the thickness direction, the second terminal surface having four sides, two of the four sides being parallel to a first direction perpendicular to the thickness direction, other two of the four sides being parallel to a second direction perpendicular to the thickness direction and the first direction;
• and
• a second wiring member connected to the second terminal surface through solder, the second wiring member having a single connection region and a single groove at a facing surface facing the terminal, the single connection region connected to the terminal, the single groove accommodating a surplus portion of the solder,
• wherein the single groove surrounds only the single connection region, and
• wherein, in a plan view of the single groove in the thickness direction, the single groove does not overlap at least one of the four sides of the second terminal surface.