Moldless semiconductor device and photovoltaic device module making use of the same
AssigneeCanon Kabushiki Kaisha
InventorsKoji Tsuzuki, Tsutomu Murakami, Satoru Yamada, Yoshifumi Takeyama, Koichi Shimizu
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Abstract
A moldless semiconductor device comprising a semiconductor chip held between outer-connecting terminals and connected electrically to the terminals is provided. At least one of the two terminals has, at its region contiguous to the semiconductor chip or at its region contiguous to the semiconductor chip and a region vicinal thereto, a hardness different from all other regions of the one terminal. This moldless semiconductor device can withstand significant external force and exhibits high reliability when used in photovoltaic device modules.
Claims22
A moldless semiconductor device comprising a semiconductor chip held between two outer-connecting terminals and connected electrically to the terminals,
- wherein at least one terminal has, at its region contiguous to the semiconductor chip or at its region contiguous to the semiconductor chip and a region vicinal thereto, a hardness different from the hardness of all other regions of said at least one terminal.
A moldless semiconductor device comprising a semiconductor chip held between two outer-connecting terminals and connected electrically to the terminals,
- wherein at least a part of the semiconductor chip is covered with an elastic material comprising an organic high polymer resin having a harness of 50 or less in JIS-A harness, the elastic material does not completely cover the moldless semiconductor device, and an outer-connecting portion of each of the two outer-connecting terminals is bare.
Dependencies are inferred from the claim text.