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AssigneeAstemo, Ltd.
InventorsNobutake TSUYUNO, Eiichi IDE, Takahiro SHIMURA
Estimating the term…
An electric circuit body includes: a semiconductor module that includes a semiconductor element sealed with a sealing material and that has a heat dissipation surface on at least one surface, the heat dissipation surface dissipating heat generated by the semiconductor element; a cooling member disposed counter to the heat dissipation surface of the semiconductor module, the cooling member cooling the semiconductor element that generates heat; and a fixing member buried in the sealing material of the semiconductor module, the fixing member restricting movement of the cooling member in the direction of separating away from the semiconductor module. The fixing member includes a buried part buried in the sealing material, and a fixing part inserted into the cooling member to fix the cooling member. At a boundary between the buried part and the fixing part, the buried part has a margin part encircling the outer periphery of the fixing part and exposed from the surface of the sealing material.
An electric circuit body comprising:
A method for manufacturing an electric circuit body which includes a semiconductor element, a cooling member that cools the semiconductor element that generates heat, and a fixing member that fixes the cooling member and in which the semiconductor element and the fixing member are sealed with a sealing material, wherein
Dependencies are inferred from the claim text.