Power electronic module packaging

A method for fabricating a power circuit module, comprising:

• attaching a substantially planar membrane to a carrier frame;
• forming vias according to a predetermined pattern in the membrane;
• applying a bond layer to the membrane;
• attaching power devices to the membrane over the bond layer to provide a device-on-membrane structure, the device-on-membrane structure having an upper device portion and a lower membrane portion;
• metalizing and patterning to form a predetermined circuit configuration over the membrane such that thermal and electrical connections are formed with the power devices through the predetermined metalized via pattern;
• removing the carrier frame from the device-on-membrane structure;
• attaching at least one thermal base sub-assembly to the device-on-membrane structure, the at least one thermal base sub-assembly comprising a ceramic base plate having two sides, each side having a metalization layer thereon, each metalization layer comprising an etched metal or metal composite layer, at least one of the metalization layers having a variable thickness of metalization so as to accommodate power devices of different thicknesses, each thermal base assembly further comprising a heat exchanger associated therewith for providing a low resistance path away from the device-on-membrane structure;
• and
• providing a housing for packaging the device-on-membrane structure and the at least one thermal base sub-assembly.