Monolithic spring assemblies for high-frequency press-pack modules
OwnerJun Wang, Youssef Abotaleb +1inventors
InventorsJun Wang, Youssef Abotaleb, Ekaterina Muravleva
Life of this patent
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Abstract
A spring for use in a semiconductor device is provided, which includes a body having a plurality of slits to allow the body to deflect along a first direction; and one or more legs at one or both ends of the body. The plurality of slits are located in a plurality of planes perpendicular to the first direction and distributed along the first direction. The slits in a particular plane of the plurality of planes are interleaved with the slits in an adjacent plane of the plurality of planes. The plurality of slits include at least a first section and a second section. A height of the first section along the first direction is different from that of the second section.
Claims20
A spring for use in a semiconductor device, the spring comprising:
- a body having a plurality of slits to allow the body to deflect along a first direction, wherein the plurality of slits comprise at least a first slit comprising a first section and a second section, a height of the first section along the first direction being different from that of the second section;
- and
- one or more legs at one or both ends of the body,
- wherein the plurality of slits are located in a plurality of planes perpendicular to the first direction and distributed along the first direction, and
- wherein the slits in a particular plane of the plurality of planes are interleaved with the slits in an adjacent plane of the plurality of planes.
A power module, comprising:
- a baseplate carrying one or more dies and a control circuit;
- the one or more dies each comprising one or more switch devices;
- a spring comprising:
- a body having a plurality of slits to allow the body to deflect along a first direction, wherein the plurality of slits comprise at least a first slit comprising a first section and a second section, a height of the first section along the first direction being different from that of the second section;
- and
- one or more legs at one or both ends of the body;
- wherein the plurality of slits are located in a plurality of planes perpendicular to the first direction and distributed along the first direction,
- wherein the slits in a particular plane of the plurality of planes are interleaved with the slits in an adjacent plane of the plurality of planes, and
- wherein each leg of the one or more legs contacts one die of the one or more dies by pressure provided by the spring;
- a lid connected to one end of the body of the spring, wherein a current path is formed from the lid through the spring and the one or more dies to the baseplate;
- and
- the control circuit electrically connected to the switch devices comprised in the one or more dies.
A method for fabricating a power module, comprising:
- providing a baseplate, the baseplate integrated with one or more dies and a control circuit, wherein the one or more dies each comprises one or more switch devices, and wherein the control circuit is electrically connected to the switch devices comprised in the one or more dies;
- providing a spring, wherein the spring comprises:
- a body having a plurality of slits to allow the body to deflect along a first direction, wherein the plurality of slits comprise at least a first slit comprising a first section and a second section, a height of the first section along the first direction being different from that of the second section;
- and
- one or more legs at one end of the body;
- and
- a top surface at the other end of the body,
- wherein the plurality of slits are located in a plurality of planes perpendicular to the first direction and distributed along the first direction, and
- wherein the slits in a particular plane of the plurality of planes are interleaved with the slits in an adjacent plane of the plurality of planes, and
- placing each leg of the one or more legs on one die of the one or more dies to form a contact between the particular leg and the corresponding die, wherein the spring provides pressure to the contact between the particular leg and the corresponding die;
- and
- placing a lid on the top surface of the body of the spring, wherein a current path is formed from the lid through the spring and the one or more dies to the baseplate.
Dependencies are inferred from the claim text.