Semiconductor device
AssigneeFuji Electric Co., Ltd.
InventorsShinji Tada, Yuma Murata
Life of this patent
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Abstract
A semiconductor device, including a case that has a first power terminal including a first bonding area and a second power terminal including a second bonding area, and an insulating unit located between the first power terminal and the second power terminal, and having a shape of a flat plate, the insulating unit being bonded to the case. The insulating unit has a first insulating portion in a sheet form, and a second insulating portion which covers an upper surface, a lower surface, or both the upper and lower surfaces, of the first insulating portion. The first bonding area and the second bonding area are exposed from the insulating unit and from the case.
Claims14
A semiconductor device, comprising:
- a case having
- a first power terminal including a first bonding area, and
- a second power terminal including a second bonding area;
- and
- an insulating unit located between the first power terminal and the second power terminal, and having a shape of a flat plate, the insulating unit being bonded to the case, wherein
- the insulating unit has
- a first insulating portion in a sheet form, and
- a second insulating portion which covers and directly contacts an upper surface,
- a lower surface, or both the upper and lower surfaces, of the first insulating portion,
- the first bonding area and the second bonding area are exposed from the insulating unit and from the case.
A semiconductor device, comprising:
- a case having
- a first power terminal including a first bonding area, and
- a second power terminal including a second bonding area;
- and
- an insulating unit located between the first power terminal and the second power terminal, and having a shape of a flat plate, the insulating unit being bonded to the case, wherein
- the insulating unit has
- a first insulating portion in a sheet form, and
- a second insulating portion which covers an upper surface, a lower surface, or both the upper and lower surfaces, of the first insulating portion,
- the first bonding area and the second bonding area are exposed from the insulating unit and from the case, wherein
- the first and the second insulting portions are made of different materials.
Dependencies are inferred from the claim text.