H10W 76/161
Containers comprising no base
Official title: {Containers comprising no base}
H10W76/161 (Containers comprising no base) appears on 147 US grants and 173 published applications in this corpus.
Search patents in H10W- Granted patents
- 147
- Published applications
- 173
- Assignees
- 89
- Inventors
- 362
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 3 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 2 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 1 | 0 |
| 1992 | 2 | 0 |
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 1 | 0 |
| 1997 | 1 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 1 | 0 |
| 2001 | 1 | 0 |
| 2002 | 0 | 1 |
| 2003 | 1 | 0 |
| 2004 | 1 | 2 |
| 2005 | 1 | 2 |
| 2006 | 2 | 4 |
| 2007 | 0 | 1 |
| 2008 | 1 | 5 |
| 2009 | 1 | 3 |
| 2010 | 3 | 4 |
| 2011 | 4 | 9 |
| 2012 | 5 | 3 |
| 2013 | 6 | 3 |
| 2014 | 3 | 2 |
| 2015 | 2 | 5 |
| 2016 | 8 | 10 |
| 2017 | 7 | 10 |
| 2018 | 5 | 13 |
| 2019 | 14 | 8 |
| 2020 | 10 | 13 |
| 2021 | 9 | 12 |
| 2022 | 8 | 9 |
| 2023 | 12 | 13 |
| 2024 | 10 | 15 |
| 2025 | 7 | 13 |
| 2026 | 9 | 13 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Package structure including a package lid having a plurality of fins and methods of forming the same15 Sep 2026US 12,740,411 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Electronic device having a supply terminal and a thermal bridge15 Sep 2026US 12,740,413 B2Infineon Technologies AG
- Current sensor with inverted shielding element15 Sep 2026US 12,740,436 B2Littelfuse Semiconductor (Wuxi) Co., Ltd.
- Semiconductor package15 Sep 2026US 12,740,488 B2Samsung Electronics Co., Ltd.
- Power semiconductor module arrangement and housing for a power semiconductor module arrangement12 May 2026US 12,628,688 B2Infineon Technologies AG
- Semiconductor device10 Sep 2026US 2026/0271712 A1Mitsubishi Electric Corporation
- Frame module for a semiconductor integrated circuit, ic, as well as a power module comprising such a frame module and a method of manufacturing such a frame module10 Sep 2026US 2026/0271778 A1Nexperia B. V.
- Method for Increasing Pin Alignment Accuracy for a Power Semiconductor Module20 Aug 2026US 2026/0247986 A1Infineon Technologies AG
- Heat dissipation structure for semiconductor package module and electronic device including the same23 Jul 2026US 2026/0215275 A1Unick Corporation
- Side-by-side die interconnection16 Jul 2026US 2026/0206621 A1QUALCOMM Incorporated
Most cited
By later US patents
- Method of making a post molded cavity package with internal dam bar for integrated circuit43US 5,106,784 ATexas Instruments Incorporated · 1992
- Electronic device packaging assembly41US 5,389,739 AHewlett-Packard Company · 1995
- Double side cooled, pressure mounted semiconductor package and process for the manufacture thereof39US 4,129,243 AGeneral Electric Company · 1978
- Flip chip substrate design39US 6,661,082 B1Fairchild Semiconductor Corporation · 2003
- Hermetically sealed package35US 4,420,652 ASeikosha Co., Ltd. · 1983